EP3SL50F780C2

The EP3SL50F780C2 is a Stratix® III L field programmable gate array (FPGA) offered in a 780-FBGA (29 × 29) surface-mount package. It provides a high-density programmable logic fabric with 47,500 logic elements and approximately 2.18 Mbits of embedded RAM, designed for commercial-temperature electronic designs.

With 488 device I/O pins, a core supply range of 0.86 V to 1.15 V, and RoHS compliance, this device targets designs that require significant on-chip logic, memory resources, and extensive I/O in a compact FCBGA package.

Key Features

• Core Logic — 47,500 logic elements available to implement high-density programmable logic functions and complex digital designs.
• Logic Structure — 1,900 logic array blocks (LABs/CLBs) that structure the device's logic resources for modular design partitioning.
• Embedded Memory — Approximately 2.18 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage for system-level functions.
• High I/O Count — 488 device I/O pins to support broad interfacing requirements and multi-channel connectivity.
• Power and Voltage — Core supply voltage range from 0.86 V to 1.15 V to match compatible system power rails.
• Package and Mounting — 780-BBGA (FCBGA) package, supplier designation 780-FBGA (29 × 29), supplied in a surface-mount form factor for compact board-level integration.
• Operating Range — Commercial-grade operation from 0 °C to 85 °C for standard commercial environments.
• Environmental Compliance — RoHS-compliant construction supporting regulatory requirements for lead-free assemblies.

Typical Applications

• High-density programmable logic — Implement custom digital functions and complex state machines using the device's 47,500 logic elements and structured LAB resources.
• Memory-intensive functions — Use the approximately 2.18 Mbits of embedded RAM for buffering, packet storage, and on-chip data handling within system designs.
• Multi-channel I/O systems — Leverage 488 I/O pins for applications that require extensive parallel interfaces or numerous peripheral connections.

Unique Advantages

• High logic capacity: 47,500 logic elements provide the density needed to consolidate multiple functions into a single FPGA, reducing board-level complexity.
• Substantial on-chip RAM: Approximately 2.18 Mbits of embedded memory supports data buffering and local storage without external RAM.
• Extensive I/O availability: 488 device I/O pins enable broad interfacing options for multi-channel and mixed-signal front-end designs.
• Compact FCBGA package: 780-BBGA (29 × 29) surface-mount package offers a high-pin-count solution in a space-efficient form factor.
• Commercial-temperature qualification: Rated 0 °C to 85 °C to meet standard commercial application environments.
• RoHS compliance: Lead-free, RoHS-compliant manufacturing supports regulatory and environmental requirements.

Why Choose EP3SL50F780C2?

The EP3SL50F780C2 combines significant logic capacity, embedded memory, and a large I/O complement in a compact 780-FBGA surface-mount package, making it suitable for commercial designs that require consolidated programmable logic and on-chip resources. Its supply voltage range and commercial operating temperature make it appropriate for standard board-level implementations where high-density programmable logic and extensive interfacing are priorities.

Choose this FPGA when your design needs approximately 47,500 logic elements, roughly 2.18 Mbits of embedded RAM, and up to 488 I/O in a 780-BBGA package with RoHS compliance for commercial-temperature applications.

Request a quote or submit a pricing inquiry to receive availability and purchasing information for the EP3SL50F780C2.