EP3SL50F780C2N

The EP3SL50F780C2N is a Stratix® III L Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 780-BBGA FCBGA package. It combines a high logic element count with substantial on-chip memory and a large I/O complement for complex, programmable digital designs.

Designed for commercial-grade applications, this device targets systems that require dense programmable logic, embedded memory, and extensive I/O connectivity while operating within a 0 °C to 85 °C range and a core supply range of 860 mV to 1.15 V.

Key Features

• Core Logic – 47,500 logic elements and 1,900 CLBs provide significant programmable resources for complex digital designs and custom logic implementations.
• Embedded Memory – Approximately 2.18 Mbits of on-chip RAM for data buffering, FIFOs, and state storage without external memory.
• I/O Capacity – 488 user I/O pins to support wide parallel interfaces, multiple peripherals, and extensive board-level connectivity.
• Power – Core voltage supply range of 860 mV to 1.15 V to match platform power architectures and optimize power delivery.
• Package & Mounting – Supplied in a 780-BBGA, FCBGA (780-FBGA, 29×29) package suitable for surface-mount assembly on high-density PCBs.
• Operating Range & Grade – Commercial grade device rated for 0 °C to 85 °C operating temperature and RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Custom FPGA-based Systems – Implement bespoke digital logic, protocol conversion, and data processing functions using the device's high logic element count and embedded memory.
• High-density I/O Interfaces – Support wide parallel buses and multiple peripheral connections with 488 available I/O pins for board-level integration.
• Data Buffering and Timing Control – Leverage approximately 2.18 Mbits of on-chip RAM for FIFO buffering, latency management, and small embedded memory tasks.

Unique Advantages

• Substantial Logic Resources: 47,500 logic elements enable consolidation of multiple functions into a single FPGA, reducing board space and BOM complexity.
• Significant Embedded Memory: Approximately 2.18 Mbits of on-chip RAM reduces reliance on external memory and streamlines memory-latency critical designs.
• Extensive I/O Count: 488 I/Os provide flexibility for interfacing to a broad range of peripherals and high-pin-count connectors without external multiplexing.
• Compact BGA Package: 780-FBGA (29×29) delivers high pin density in a surface-mount form factor suited for compact, high-performance PCBs.
• Commercial Grade and RoHS Compliant: Rated for 0 °C to 85 °C operation and RoHS compliance for standard commercial product deployments and environmental compliance.

Why Choose EP3SL50F780C2N?

The EP3SL50F780C2N is positioned for designers who need a high-density FPGA solution with a large logic element count, meaningful on-chip memory, and a wide I/O complement in a compact BGA package. Its commercial-grade temperature range and RoHS compliance make it suited for mainstream electronic products and complex prototype systems.

This device offers a balance of integration and I/O capability that helps reduce system-level component count, simplify board design, and support a range of programmable functions within the specified voltage and temperature envelope.

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