EP3SL50F780C3G
| Part Description |
Stratix® III L Field Programmable Gate Array (FPGA) IC 488 2184192 47500 780-BBGA, FCBGA |
|---|---|
| Quantity | 914 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 488 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1900 | Number of Logic Elements/Cells | 47500 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 2184192 |
Overview of EP3SL50F780C3G – Stratix® III L FPGA, 47,500 logic elements
The EP3SL50F780C3G is a Stratix® III L family Field Programmable Gate Array (FPGA) in a 780-ball FCBGA package. It combines a high logic element count and substantial embedded memory to support high-performance logic, DSP and embedded system integration in commercial applications.
Designed for balanced compute, memory and multiplier ratios, this device is suitable for applications that require programmable high-density logic, modular I/O and flexible power options while operating within a commercial temperature range.
Key Features
- Logic Capacity — 47,500 logic elements delivered across 1,900 LABs (logic array blocks), enabling complex programmable logic designs.
- Embedded Memory — Approximately 2.18 Mbits of on-chip RAM (2,184,192 total bits) for FIFOs, buffers and embedded data structures.
- I/O Integration — 488 user I/Os arranged for modular banked interfaces to support a variety of signaling standards and memory interfaces.
- Package & Mounting — 780-BBGA, FCBGA package (supplier package: 780-FBGA, 29×29) optimized for surface-mount assembly.
- Core Voltage Range — Voltage supply range from 860 mV to 1.15 V, consistent with selectable core-voltage operation in the Stratix III L family.
- Clocking & PLLs — Family features include up to 16 global clocks, 88 regional clocks and support for up to 12 phase-locked loops (PLLs) for flexible clock management.
- High-Speed I/O Capability — Stratix III family supports high-speed differential I/O and SERDES with dynamic phase alignment for high-throughput interfaces.
- Security & Reliability — Family-level support for optional 256-bit AES volatile and non-volatile configuration key protection, CRC-based configuration error detection and ECC for embedded memory.
- Operating Range & Compliance — Commercial grade device rated for 0 °C to 85 °C and RoHS compliant.
Typical Applications
- High-performance logic and DSP — Implement custom logic, signal processing chains and multiply-accumulate functions using the device’s dense logic and on-chip memory.
- Memory interface controllers — Use modular I/O banks and dedicated DQS support to implement DDR/DDR2/DDR3 and other external memory interfaces.
- Communications & networking — Deploy SERDES and high-speed differential I/O for protocol implementation, framing and data path processing.
- Embedded systems and prototyping — Integrate control logic and IP cores with available on-chip resources and PLL-based clock synthesis.
Unique Advantages
- Balanced resource mix: 47,500 logic elements paired with ~2.18 Mbits of embedded memory provides a strong combination for mixed logic and memory-intensive designs.
- Flexible clocking: Multiple global, regional and peripheral clocks plus up to 12 PLLs allow complex timing architectures and clock domain management.
- Security options: Family-level support for 256-bit AES configuration key protection helps safeguard bitstream IP and device configuration.
- Robust I/O and SERDES support: Modular I/O banks and high-speed differential support enable a wide range of external interfaces and high-throughput channels.
- Commercial-temperature rating and RoHS compliance: Suited to mainstream commercial applications with environmental compliance for lead-free assembly.
- Compact BGA footprint: 780-ball FCBGA (29×29) package offers high pin-count and density for space-constrained board designs.
Why Choose EP3SL50F780C3G?
The EP3SL50F780C3G positions itself as a programmable, high-capacity FPGA option within the Stratix III L family, offering a balanced combination of logic, embedded memory and I/O resources for commercial high-performance designs. Its selectable core-voltage architecture, extensive clocking and PLL resources, and family-level security and reliability features make it a practical choice for teams implementing DSP, memory interfaces and communications protocols.
This device is well suited for developers and engineers needing a scalable, programmable solution that integrates significant on-chip memory and a high logic element count in a compact FCBGA package, backed by the Stratix III family feature set.
Request a quote or submit a procurement inquiry to obtain pricing, availability and technical support for the EP3SL50F780C3G.

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