EP3SL50F780C3G

IC FPGA 488 I/O 780FBGA
Part Description

Stratix® III L Field Programmable Gate Array (FPGA) IC 488 2184192 47500 780-BBGA, FCBGA

Quantity 914 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O488Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1900Number of Logic Elements/Cells47500
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits2184192

Overview of EP3SL50F780C3G – Stratix® III L FPGA, 47,500 logic elements

The EP3SL50F780C3G is a Stratix® III L family Field Programmable Gate Array (FPGA) in a 780-ball FCBGA package. It combines a high logic element count and substantial embedded memory to support high-performance logic, DSP and embedded system integration in commercial applications.

Designed for balanced compute, memory and multiplier ratios, this device is suitable for applications that require programmable high-density logic, modular I/O and flexible power options while operating within a commercial temperature range.

Key Features

  • Logic Capacity — 47,500 logic elements delivered across 1,900 LABs (logic array blocks), enabling complex programmable logic designs.
  • Embedded Memory — Approximately 2.18 Mbits of on-chip RAM (2,184,192 total bits) for FIFOs, buffers and embedded data structures.
  • I/O Integration — 488 user I/Os arranged for modular banked interfaces to support a variety of signaling standards and memory interfaces.
  • Package & Mounting — 780-BBGA, FCBGA package (supplier package: 780-FBGA, 29×29) optimized for surface-mount assembly.
  • Core Voltage Range — Voltage supply range from 860 mV to 1.15 V, consistent with selectable core-voltage operation in the Stratix III L family.
  • Clocking & PLLs — Family features include up to 16 global clocks, 88 regional clocks and support for up to 12 phase-locked loops (PLLs) for flexible clock management.
  • High-Speed I/O Capability — Stratix III family supports high-speed differential I/O and SERDES with dynamic phase alignment for high-throughput interfaces.
  • Security & Reliability — Family-level support for optional 256-bit AES volatile and non-volatile configuration key protection, CRC-based configuration error detection and ECC for embedded memory.
  • Operating Range & Compliance — Commercial grade device rated for 0 °C to 85 °C and RoHS compliant.

Typical Applications

  • High-performance logic and DSP — Implement custom logic, signal processing chains and multiply-accumulate functions using the device’s dense logic and on-chip memory.
  • Memory interface controllers — Use modular I/O banks and dedicated DQS support to implement DDR/DDR2/DDR3 and other external memory interfaces.
  • Communications & networking — Deploy SERDES and high-speed differential I/O for protocol implementation, framing and data path processing.
  • Embedded systems and prototyping — Integrate control logic and IP cores with available on-chip resources and PLL-based clock synthesis.

Unique Advantages

  • Balanced resource mix: 47,500 logic elements paired with ~2.18 Mbits of embedded memory provides a strong combination for mixed logic and memory-intensive designs.
  • Flexible clocking: Multiple global, regional and peripheral clocks plus up to 12 PLLs allow complex timing architectures and clock domain management.
  • Security options: Family-level support for 256-bit AES configuration key protection helps safeguard bitstream IP and device configuration.
  • Robust I/O and SERDES support: Modular I/O banks and high-speed differential support enable a wide range of external interfaces and high-throughput channels.
  • Commercial-temperature rating and RoHS compliance: Suited to mainstream commercial applications with environmental compliance for lead-free assembly.
  • Compact BGA footprint: 780-ball FCBGA (29×29) package offers high pin-count and density for space-constrained board designs.

Why Choose EP3SL50F780C3G?

The EP3SL50F780C3G positions itself as a programmable, high-capacity FPGA option within the Stratix III L family, offering a balanced combination of logic, embedded memory and I/O resources for commercial high-performance designs. Its selectable core-voltage architecture, extensive clocking and PLL resources, and family-level security and reliability features make it a practical choice for teams implementing DSP, memory interfaces and communications protocols.

This device is well suited for developers and engineers needing a scalable, programmable solution that integrates significant on-chip memory and a high logic element count in a compact FCBGA package, backed by the Stratix III family feature set.

Request a quote or submit a procurement inquiry to obtain pricing, availability and technical support for the EP3SL50F780C3G.

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