EP3SL50F780C4L

The EP3SL50F780C4L is a Stratix® III L Field Programmable Gate Array (FPGA) IC designed for applications requiring substantial programmable logic, embedded memory, and a high I/O count in a compact ball-grid array package. Its architecture provides 47,500 logic elements and approximately 2.18 Mbits of on-chip RAM, enabling implementation of complex logic functions and memory-intensive subsystems.

Packaged in a 780-ball FCBGA (780-BBGA) with a 29×29 supplier package footprint and intended for surface-mount assembly, this commercial-grade device operates from a core supply range of 860 mV to 1.15 V and across an operating temperature of 0 °C to 85 °C.

Key Features

• Core Logic Capacity  47,500 logic elements suitable for substantial programmable logic integration without external logic devices.
• Embedded Memory  Approximately 2.18 Mbits of on-chip RAM to support buffered data paths, state storage, and algorithmic working memory.
• I/O Resources  488 I/O pins to support broad interfacing needs for parallel buses, control signals, and multiple external peripherals.
• Power Supply  Operates with a core voltage supply range of 860 mV to 1.15 V to match system power-rail designs.
• Package & Mounting  780-ball BGA (FCBGA) package, supplier package 780-FBGA (29×29), designed for surface-mount PCB assembly and high-density layouts.
• Operating Grade & Temperature  Commercial grade device specified for operation from 0 °C to 85 °C.
• Regulatory Compliance  RoHS compliant for materials and environmental requirements.

Unique Advantages

• High logic density: 47,500 logic elements allow consolidation of multiple functions into a single FPGA, reducing board-level part count.
• Integrated memory capacity: Approximately 2.18 Mbits of embedded RAM supports larger on-chip buffers and reduces reliance on external memory.
• Generous I/O availability: 488 I/O pins provide flexibility for complex interconnects and peripheral interfaces without additional I/O expanders.
• Compact BGA footprint: 780-ball FCBGA in a 29×29 supplier package enables dense PCB designs while maintaining access to abundant I/O.
• Low-voltage core operation: Support for a core supply range down to 860 mV enables integration with modern low-voltage system rails.
• Commercial-grade reliability: Specified for 0 °C to 85 °C operation and RoHS compliance for streamlined procurement and manufacturing.

Why Choose EP3SL50F780C4L?

The EP3SL50F780C4L positions itself as a high-capacity Stratix® III L FPGA option for designs that require a large number of logic elements, substantial on-chip memory, and wide I/O capability in a compact surface-mount BGA package. Its electrical and thermal specifications make it well suited for commercial embedded systems where integration density and flexible interfacing are priorities.

For engineering teams and procurement seeking a scalable programmable platform with clear, verifiable specifications—logic density, embedded memory size, I/O count, package details, and operating ranges—this device offers a focused balance of integration and specification transparency for long-term development and production use.

Request a quote or submit a pricing inquiry for the EP3SL50F780C4L to begin your procurement or design evaluation today.