EP3SL50F780C4G

The EP3SL50F780C4G is a Stratix® III L Field Programmable Gate Array (FPGA) IC from Intel designed for commercial electronic applications that require significant programmable logic, embedded memory, and I/O capacity. This device integrates 47,500 logic elements and approximately 2.18 Mbits of on-chip RAM to support complex, customized digital designs.

With 488 I/O pins, a 780-BBGA package option, surface-mount mounting, and a supply voltage range of 860 mV to 1.15 V, the EP3SL50F780C4G targets designs that need high I/O integration and flexible on-chip resources while operating across a standard commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic 47,500 logic elements for implementing custom digital functions and control logic.
• Embedded Memory Approximately 2.18 Mbits of on-chip RAM to store configuration data, buffers, and intermediate processing state.
• I/O Capacity 488 available I/Os to support wide parallel interfaces, multiple peripheral connections, and board-level integration.
• Package and Mounting 780-BBGA package (supplier device package: 780-FBGA, 29 × 29) designed for surface-mount assembly.
• Power Supply Operates with a supply voltage range of 860 mV to 1.15 V, enabling integration into designs with defined core-voltage requirements.
• Operating Range Commercial grade device rated for 0 °C to 85 °C operation.
• Regulatory Compliance RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Communications Equipment Implement protocol logic, parallel interfaces, and I/O aggregation using the FPGA’s large logic array and high I/O count.
• Test and Measurement Systems Create custom signal conditioning, data capture, and processing pipelines leveraging on-chip memory and logic resources.
• Embedded System Prototyping Rapidly prototype custom digital subsystems and interface logic with flexible reprogrammability and abundant I/Os.
• Video and Imaging Processing Use the device’s logic and memory resources to implement buffering, control logic, and parallel data paths for image pipelines.

Unique Advantages

• Substantial Logic Capacity: 47,500 logic elements provide the headroom to implement complex, multi-function digital designs without immediate migration.
• Embedded Memory On-Die: Approximately 2.18 Mbits of RAM reduces external memory dependencies for buffering and intermediate data storage.
• High I/O Count: 488 I/Os simplify board-level integration for designs requiring many parallel interfaces or multiple peripheral connections.
• Compact Surface-Mount Package: 780-BBGA (780-FBGA, 29 × 29) supports dense PCB layouts while maintaining a standardized supplier package footprint.
• Commercial Temperature Rating: Rated 0 °C to 85 °C to meet typical commercial deployment environments and test conditions.
• RoHS Compliant: Supports environmentally responsible manufacturing and compliance workflows.

Why Choose EP3SL50F780C4G?

The EP3SL50F780C4G delivers a balanced combination of logic density, on-chip memory, and extensive I/O in a commercial-grade Stratix® III L FPGA package. It is suitable for engineers and designers building complex, programmable digital systems that require significant integration of logic and I/O in a surface-mount form factor.

For teams focused on scalable prototypes or production designs where vendor ecosystem and device-level resources matter, this FPGA provides a solid platform for consolidating functions, reducing external component count, and supporting evolving design requirements.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the EP3SL50F780C4G.