EP3SL50F484C4N

The EP3SL50F484C4N is a Stratix® III L field-programmable gate array (FPGA) IC supplied in a 484-ball BGA (FCBGA) package. It integrates substantial logic capacity, embedded RAM and a high I/O count to address complex digital design requirements.

This device is specified with 47,500 logic elements, approximately 2.18 Mbits of on-chip RAM, and 296 I/O pins, and is intended for commercial-temperature electronic designs that require high-density programmable logic and flexible I/O integration.

Key Features

• Core Logic  47,500 logic elements provide a large programmable fabric for implementing complex state machines, datapaths and custom logic functions.
• Embedded Memory  Approximately 2.18 Mbits of on-chip RAM to support buffering, lookup tables and on-chip data storage without external memory for many functions.
• I/O Capacity  296 I/O pins allow broad connectivity to peripherals, interfaces and board-level signals for flexible system integration.
• Package & Mounting  484-ball BGA (FCBGA) package, supplier package 484-FBGA (23×23), designed for surface-mount assembly on modern PCB designs.
• Power Supply  Supports a core supply voltage range of 860 mV to 1.15 V, enabling designs that target the specified core voltage window.
• Operating Temperature  Commercial-grade operating range from 0 °C to 85 °C for standard commercial applications.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital logic  Implement complex control logic, custom processors or protocol handlers using the device’s 47,500 logic elements and on-chip memory.
• Data buffering and local storage  Use the approximately 2.18 Mbits of embedded RAM for FIFOs, frame buffers or temporary data storage close to logic blocks.
• High I/O interface bridging  Connect multiple peripherals and bus interfaces with the 296 available I/O pins to consolidate glue logic on a single FPGA.

Unique Advantages

• High logic capacity: 47,500 logic elements enable implementation of large-scale custom digital functions without partitioning across multiple devices.
• Significant on-chip RAM: Approximately 2.18 Mbits of embedded memory reduces dependence on external memory for many buffering and caching tasks.
• Extensive I/O: 296 I/O pins provide flexible connectivity for complex boards and multi-interface designs, minimizing external interface components.
• Compact BGA footprint: 484-ball FCBGA package (23×23) delivers high pin density in a surface-mount form factor suitable for space-constrained PCBs.
• Commercial temperature support: Rated 0 °C to 85 °C for standard commercial deployments.
• RoHS compliant: Meets RoHS requirements for lead-free assembly and environmental considerations.

Why Choose EP3SL50F484C4N?

The EP3SL50F484C4N combines a large programmable logic array, meaningful on-chip RAM and a high I/O count within a 484-ball BGA package to address dense, integration-focused designs. Its commercial-grade temperature range and RoHS compliance make it suitable for mainstream electronic products where substantial programmable resources and board-level connectivity are required.

This device is well suited to design teams implementing complex custom logic, local data buffering or multi-interface bridging who need a single-chip solution with clear electrical and thermal operating limits and a compact surface-mount package.

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