EP3SL50F484C4LG

The EP3SL50F484C4LG is a Stratix® III L field programmable gate array (FPGA) in a 484-ball BGA (FCBGA) package, optimized for balanced logic, memory, and multiplier ratios. It targets high-performance logic, digital signal processing, and embedded designs that require substantial on-chip resources and flexible I/O.

Built on the Stratix III L family architecture, the device combines approximately 47,500 logic elements, roughly 2.18 Mbits of embedded RAM, and 296 user I/O in a surface-mount 484-FBGA (23×23) package. The device supports selectable core voltage operation and power-optimization features to match performance and efficiency needs.

Key Features

• Logic Density  Approximately 47,500 logic elements to implement complex state machines, control logic, and programmable datapaths.
• Embedded Memory  Approximately 2.18 Mbits of on-chip RAM for FIFOs, buffers, and local data storage.
• I/O Capacity  296 user I/O pins arranged to support diverse peripheral and memory interfaces in a compact package.
• Package and Mounting  484-ball BGA (FCBGA) package; supplier device package specified as 484-FBGA (23×23). Surface-mount mounting type for board-level integration.
• Core Voltage Range  Selectable core voltage operation with supply range from 860 mV to 1.15 V to balance performance and power.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operating temperature suitable for commercial applications.
• Power Optimization  Stratix III family Programmable Power Technology and selectable core voltage enable power/performance trade-offs (family-level feature).
• Security and Reliability (Family Features)  Stratix III family supports optional 256-bit AES configuration encryption and configuration memory CRC/ECC features for design protection and integrity (series-level capabilities).

Typical Applications

• High-performance DSP and Signal Processing  Implement FIR filters, MAC engines, and custom DSP datapaths using the device's logic density and embedded memory.
• Communications and Networking  Support for high-density I/O and SERDES-capable family features make the device suitable for protocol processing, packet handling, and interface bridging.
• Memory Interface Controllers  Use on-chip memory and I/O resources to build controllers and interface logic for external DDR/DDR2/DDR3 and other memory types (family-level memory interface support).
• Embedded Systems and Soft Processors  Integrate control, glue logic, and Nios® II embedded processor-based subsystems in a single programmable device.

Unique Advantages

• Balanced integration: Combines substantial logic (≈47,500 LEs) and embedded memory (≈2.18 Mbits) for mixed control and data-centric functions, reducing the need for external components.
• Flexible power/performance trade-offs: Selectable core voltage (860 mV–1.15 V) and family Programmable Power Technology allow designers to tune for power efficiency or higher clocking headroom.
• High I/O density in a compact BGA: 296 user I/Os in a 484-FBGA (23×23) package enable dense system I/O without a larger footprint.
• Design security and reliability options: Series-level support for AES configuration encryption and configuration memory CRC/ECC improves IP protection and system robustness.
• Commercial temperature rating and RoHS compliance: Rated 0 °C to 85 °C and RoHS-compliant for mainstream electronic product environments and regulatory alignment.
• Surface-mount compatibility: FCBGA package and surface-mount form factor simplify board-level assembly for production designs.

Why Choose EP3SL50F484C4LG?

The EP3SL50F484C4LG brings Stratix III L family capabilities—substantial logic resources, meaningful on-chip RAM, and high I/O count—into a compact 484-BBGA package. Its selectable core voltage range and family-level power-management features let engineers tune devices for their target performance or power budget while keeping system integration compact and manageable.

This device is well suited to teams building high-performance DSP, networking, memory-interface, or embedded-control systems that require programmable flexibility, on-chip memory resources, and a robust set of configuration and reliability features from the Stratix III family.

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