EP3SL50F484C4LG
| Part Description |
Stratix® III L Field Programmable Gate Array (FPGA) IC 296 2184192 47500 484-BBGA, FCBGA |
|---|---|
| Quantity | 657 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 296 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1900 | Number of Logic Elements/Cells | 47500 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 2184192 |
Overview of EP3SL50F484C4LG – Stratix® III L FPGA, 47,500 logic elements, 296 I/O, 484-BBGA
The EP3SL50F484C4LG is a Stratix® III L field programmable gate array (FPGA) in a 484-ball BGA (FCBGA) package, optimized for balanced logic, memory, and multiplier ratios. It targets high-performance logic, digital signal processing, and embedded designs that require substantial on-chip resources and flexible I/O.
Built on the Stratix III L family architecture, the device combines approximately 47,500 logic elements, roughly 2.18 Mbits of embedded RAM, and 296 user I/O in a surface-mount 484-FBGA (23×23) package. The device supports selectable core voltage operation and power-optimization features to match performance and efficiency needs.
Key Features
- Logic Density Approximately 47,500 logic elements to implement complex state machines, control logic, and programmable datapaths.
- Embedded Memory Approximately 2.18 Mbits of on-chip RAM for FIFOs, buffers, and local data storage.
- I/O Capacity 296 user I/O pins arranged to support diverse peripheral and memory interfaces in a compact package.
- Package and Mounting 484-ball BGA (FCBGA) package; supplier device package specified as 484-FBGA (23×23). Surface-mount mounting type for board-level integration.
- Core Voltage Range Selectable core voltage operation with supply range from 860 mV to 1.15 V to balance performance and power.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operating temperature suitable for commercial applications.
- Power Optimization Stratix III family Programmable Power Technology and selectable core voltage enable power/performance trade-offs (family-level feature).
- Security and Reliability (Family Features) Stratix III family supports optional 256-bit AES configuration encryption and configuration memory CRC/ECC features for design protection and integrity (series-level capabilities).
Typical Applications
- High-performance DSP and Signal Processing Implement FIR filters, MAC engines, and custom DSP datapaths using the device's logic density and embedded memory.
- Communications and Networking Support for high-density I/O and SERDES-capable family features make the device suitable for protocol processing, packet handling, and interface bridging.
- Memory Interface Controllers Use on-chip memory and I/O resources to build controllers and interface logic for external DDR/DDR2/DDR3 and other memory types (family-level memory interface support).
- Embedded Systems and Soft Processors Integrate control, glue logic, and Nios® II embedded processor-based subsystems in a single programmable device.
Unique Advantages
- Balanced integration: Combines substantial logic (≈47,500 LEs) and embedded memory (≈2.18 Mbits) for mixed control and data-centric functions, reducing the need for external components.
- Flexible power/performance trade-offs: Selectable core voltage (860 mV–1.15 V) and family Programmable Power Technology allow designers to tune for power efficiency or higher clocking headroom.
- High I/O density in a compact BGA: 296 user I/Os in a 484-FBGA (23×23) package enable dense system I/O without a larger footprint.
- Design security and reliability options: Series-level support for AES configuration encryption and configuration memory CRC/ECC improves IP protection and system robustness.
- Commercial temperature rating and RoHS compliance: Rated 0 °C to 85 °C and RoHS-compliant for mainstream electronic product environments and regulatory alignment.
- Surface-mount compatibility: FCBGA package and surface-mount form factor simplify board-level assembly for production designs.
Why Choose EP3SL50F484C4LG?
The EP3SL50F484C4LG brings Stratix III L family capabilities—substantial logic resources, meaningful on-chip RAM, and high I/O count—into a compact 484-BBGA package. Its selectable core voltage range and family-level power-management features let engineers tune devices for their target performance or power budget while keeping system integration compact and manageable.
This device is well suited to teams building high-performance DSP, networking, memory-interface, or embedded-control systems that require programmable flexibility, on-chip memory resources, and a robust set of configuration and reliability features from the Stratix III family.
Request a quote or submit a purchase inquiry to get pricing and availability for EP3SL50F484C4LG. Provide your quantity and delivery requirements to receive a tailored response.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018