EP3SL50F484C3G
| Part Description |
Stratix® III L Field Programmable Gate Array (FPGA) IC 296 2184192 47500 484-BBGA, FCBGA |
|---|---|
| Quantity | 580 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 296 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1900 | Number of Logic Elements/Cells | 47500 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 2184192 |
Overview of EP3SL50F484C3G – Stratix® III L FPGA, 47,500 Logic Elements, 484-FBGA
The EP3SL50F484C3G is a Stratix® III L field-programmable gate array (FPGA) implemented on a 65‑nm, 1.1‑V SRAM process. It delivers a balanced combination of logic, embedded memory, and DSP resources for high-performance logic, digital signal processing and embedded applications.
Designed for system integration, this commercial‑grade, surface‑mount device features 47,500 logic elements, approximately 2.18 Mbits of on‑chip RAM, and 296 user I/O pins in a 484‑FBGA (23×23) package, enabling compact, high‑density designs.
Key Features
- Core & Process Built on a 1.1‑V, 65‑nm all‑layer copper SRAM process optimized for performance and integration.
- Logic Capacity 47,500 logic elements suitable for mid‑ to high‑complexity programmable logic implementations.
- Embedded Memory Approximately 2.18 Mbits of on‑chip RAM for buffers, FIFOs and local data storage.
- DSP Resources Stratix III family DSP capabilities support a range of multiplier sizes for multiply‑accumulate functions and FIR filters (family feature).
- I/O and Package 296 user I/O pins in a 484‑FBGA (23×23) surface‑mount package, offering modular I/O bank structure for flexible interface routing.
- Clocking and PLLs Family support for multiple global and regional clocks and up to 12 phase‑locked loops for complex clocking and clock synthesis requirements.
- Power and Voltage Operates on selectable core voltages with a documented supply range of 860 mV to 1.15 V, and incorporates programmable power techniques at the family level to optimize power versus performance.
- Security and Reliability Family options include 256‑bit AES configuration encryption and built‑in configuration memory error detection and correction features for enhanced reliability.
- Operating Range and Compliance Commercial grade, RoHS‑compliant device with an operating temperature range of 0 °C to 85 °C.
Typical Applications
- High‑Performance Logic and Acceleration Implement custom logic and hardware acceleration where a balance of logic elements and embedded memory is required.
- Digital Signal Processing Use the Stratix III DSP capabilities for FIR filters, multiply‑accumulate chains and other signal processing blocks.
- Memory Interface and Controller Designs Leverage modular I/O banks and dedicated memory interface features for DDR, DDR2/DDR3 and other external memory controllers (family support).
- Networking and Communications Deploy in systems requiring high‑speed serial I/O and clocking flexibility, including serializer/deserializer and dynamic phase alignment features (family support).
- Embedded Systems and IP Integration Integrate soft processors and vendor megafunctions to accelerate embedded control and protocol handling (family support).
Unique Advantages
- Balanced resource mix: 47,500 logic elements with substantial on‑chip RAM provide an effective balance of logic and memory for mixed workloads.
- Configurable power vs. performance: Selectable core voltage and family programmable power technology enable tuning for performance or lower power operation.
- Rich clocking and PLL resources: Multiple global/regional clocks and PLLs support complex timing architectures and clock domain management.
- On‑chip reliability and security: Family‑level support for configuration CRC, ECC in memory blocks, and optional 256‑bit AES protects designs and improves availability.
- Compact, high‑pin package: 484‑FBGA (23×23) with 296 I/O lets designers implement dense interfaces in a compact footprint.
- Standards and IP ecosystem: Family support for a broad set of I/O standards and vendor megafunctions simplifies integration of common protocols and functions.
Why Choose EP3SL50F484C3G?
The EP3SL50F484C3G positions itself as a balanced, mid‑to‑high complexity Stratix III L FPGA offering: significant logic capacity, embedded memory, and family DSP capabilities in a compact 484‑FBGA package. Its selectable core voltage and family programmable power features let designers tune power and performance to application needs while built‑in reliability and security options help protect configuration and critical data.
This device is suited to designers building high‑performance logic, DSP accelerators, memory interface controllers and embedded systems that benefit from a mature FPGA family with broad IP and function support. RoHS compliance and commercial‑grade operation support deployment in mainstream electronic products and systems integration projects.
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