EP3SL50F484C2

The EP3SL50F484C2 is a Stratix® III L Field Programmable Gate Array (FPGA) offered in a 484‑ball BGA (FCBGA) package. It provides dense programmable logic, embedded memory, and a substantial I/O count in a surface‑mount package suitable for commercial applications.

With 47,500 logic elements, approximately 2.18 Mbits of embedded memory and 296 I/Os, this device is intended for designers who require on‑chip resources and flexible I/O connectivity within a compact BGA footprint.

Key Features

• Core Logic 47,500 logic elements provide programmable combinational and sequential resources for implementing custom digital functions.
• Embedded Memory Approximately 2.18 Mbits of on‑chip RAM to support data buffering, FIFOs, and localized storage for algorithm implementation.
• I/O Density 296 general‑purpose I/Os to support wide parallel interfaces, multiple peripheral connections, and board I/O consolidation.
• Power Supply voltage range from 860 mV to 1.15 V, enabling integration with systems using low‑voltage core rails.
• Package & Mounting 484‑BBGA (FCBGA), supplier device package 484‑FBGA (23×23) in a surface‑mount form factor for compact board integration.
• Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
• Compliance RoHS compliant for lead‑free manufacturing and environmental requirements.

Typical Applications

• Custom Digital Logic Implement application‑specific digital functions and control logic using the device’s programmable resources and embedded memory.
• Interface Aggregation Consolidate multiple parallel and serial interfaces onto a single device using the available 296 I/Os.
• Prototyping and Development Use the FPGA’s reprogrammability and dense logic to iterate hardware designs and validate system architectures.

Unique Advantages

• High Logic Capacity: 47,500 logic elements enable substantial on‑chip implementation of custom functions without immediate need for external logic.
• Integrated Memory Resources: Approximately 2.18 Mbits of embedded memory reduce dependence on external RAM for localized storage and buffering.
• Substantial I/O Count: 296 I/Os allow flexible connectivity to peripherals, sensors, and external devices, simplifying board routing and partitioning.
• Compact BGA Packaging: The 484‑BBGA FCBGA (23×23) package supports space‑efficient board layouts while providing high pin density.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to match standard commercial product environments and deployments.
• RoHS Compliant: Meets common environmental requirements for lead‑free assembly processes.

Why Choose EP3SL50F484C2?

The EP3SL50F484C2 positions itself as a densely provisioned Stratix® III L FPGA option for designs that require a large number of logic elements, embedded memory, and a high I/O count in a compact surface‑mount BGA package. Its combination of logic, memory, and I/O resources supports consolidation of digital functions and interface logic on a single device.

This device is suited to teams and projects seeking scalable, reprogrammable hardware building blocks for commercial‑grade systems where on‑chip resources, footprint efficiency, and compliance with RoHS are priorities.

Request a quote or submit an inquiry to purchase EP3SL50F484C2 and evaluate its fit for your next programmable logic design.