EP3SL340H1152I4N

The EP3SL340H1152I4N is a Stratix® III L Field Programmable Gate Array (FPGA) delivered in a 1152-ball BGA package for surface-mount assembly. It targets high-density, industrial applications that require large on-chip logic, substantial embedded memory, and extensive I/O capability.

With 337,500 logic elements, approximately 18.8 Mbits of embedded RAM, and up to 744 I/O pins, this device provides the integration needed for complex FPGA-based designs while supporting industrial temperature operation and RoHS compliance.

Key Features

• Logic Capacity — 337,500 logic elements to implement complex digital logic, custom processors, and wide datapaths on a single device.
• Embedded Memory — Approximately 18.8 Mbits of on-chip RAM to support buffering, look-up tables, and memory-centric logic functions.
• High I/O Count — Up to 744 I/O pins for dense peripheral interfacing, wide parallel buses, or multi-channel connections.
• Power Supply — Operates from 860 mV to 1.15 V supply rails to match system power domains and designs.
• Package and Mounting — 1152-BBGA, FCBGA package (supplier device package: 1152-HBGA, 40×40) designed for surface-mount assembly in compact board layouts.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Regulatory — RoHS compliant for environmental regulatory alignment.

Typical Applications

• High-density I/O designs — Use the 744 I/O pins to implement wide buses, multi-channel interfaces, or dense peripheral connections.
• Logic-intensive implementations — Leverage 337,500 logic elements to consolidate complex functions and custom processing into a single FPGA.
• Memory-centric designs — Approximately 18.8 Mbits of embedded RAM supports buffering, packet memory, and on-chip data storage requirements.
• Industrial systems — The −40 °C to 100 °C operating range and industrial grade make this device suitable for rugged and temperature-variable environments.

Unique Advantages

• High integration: Combines large logic capacity and substantial embedded RAM to reduce reliance on external components and simplify board-level design.
• Extensive I/O flexibility: Up to 744 I/O pins enable complex front-end and back-end interfacing without resorting to additional bridging devices.
• Industrial robustness: Rated for −40 °C to 100 °C operation, supporting deployment in temperature-challenging environments.
• Compact package options: Available in a 1152-ball BGA (40×40) footprint for high-density PCB layouts and surface-mount production.
• Regulatory alignment: RoHS compliance helps meet environmental and manufacturing requirements.

Why Choose EP3SL340H1152I4N?

The EP3SL340H1152I4N positions itself as a high-capacity, industrial-grade FPGA option that balances substantial logic resources, on-chip memory, and a large I/O count in a compact BGA package. Its specified supply range and temperature rating make it suitable for engineers designing complex, high-density systems that must operate reliably in industrial conditions.

This device is well suited for designers who require consolidation of multiple functions into a single FPGA, need abundant I/O for connectivity, and demand consistent operation across a wide temperature range. RoHS compliance and surface-mount packaging further support modern production and regulatory needs.

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