EP3SL340H1152I4G

The EP3SL340H1152I4G is an industrial-grade Stratix III family FPGA offering high logic density and substantial on-chip memory in a 1152-ball BGA package. Built for high-performance logic, DSP and embedded system designs, it delivers a combination of large programmable fabric and flexible I/O for demanding communications, networking, and compute-oriented applications.

Designed for surface-mount applications and RoHS-compliant manufacturing, this device supports a selectable core voltage range and extended operating temperature for robust performance across industrial environments.

Key Features

• Logic Capacity  Approximately 337,500 logic elements for complex logic integration and system-level consolidation.
• Embedded Memory  Approximately 18.8 Mbits of embedded memory to support large buffers, state machines, and on-chip data storage.
• I/O and Package  744 user I/O pins in a 1152-ball FCBGA/BBGA package; supplier package listed as 1152-HBGA (40×40). Surface-mount mounting facilitates board-level integration.
• Core Voltage  Selectable core supply range from 0.86 V to 1.15 V to balance performance and power consumption.
• Operating Range & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Family-Level High-Performance Features  As a Stratix III device, the family includes architecture and silicon optimizations for low power and high performance, configurable clocking resources, dedicated DSP blocks for multiplier and MAC operations, and high-speed SERDES/I/O capabilities.
• Security & Reliability  Stratix III family devices include optional 256-bit AES configuration encryption and built-in CRC/ECC circuitry for configuration and on-chip memory protection.
• Standards & Memory Interface Support  Series-level support for high-speed external memory interfaces (DDR, DDR2, DDR3, RLDRAM II, QDR II) and a broad set of communications standards via modular I/O banks.

Typical Applications

• High-Performance DSP and Signal Processing  Dense logic and substantial embedded RAM enable implementation of FIR filters, FFTs, and other DSP pipelines using on-chip DSP resources.
• Networking & Communications  Modular I/O and high-speed SERDES support system designs for packet processing, interconnect bridging, and protocol adaptation.
• Memory Interface Controllers  Embedded memory and family-level memory interface features support DDR/DDR2/DDR3 controller implementations and memory buffering.
• Embedded Systems & Prototyping  Large logic capacity and on-chip resources make the device suitable for complex SoC prototyping, hardware acceleration, and Nios II-based embedded designs.

Unique Advantages

• High Logic Integration: Consolidate multiple functions on-chip with roughly 337,500 logic elements, reducing external glue logic and BOM complexity.
• Substantial On-Chip Memory: Approximately 18.8 Mbits of embedded RAM allow larger buffers and state storage without external memory dependency.
• Flexible Power Scaling: Core supply range from 0.86 V to 1.15 V enables designers to tune for lower power or higher performance as required.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports industrial deployments and extended-environment products.
• Robust System Features: Family-level support for AES configuration encryption, ECC/CRC protection, and comprehensive clocking/PLLs improves security and reliability for long-life systems.
• Compact Surface-Mount Package: 1152-ball BGA package with 744 user I/O provides a high-density solution for space-constrained PCBs.

Why Choose EP3SL340H1152I4G?

The EP3SL340H1152I4G combines high logic density, significant embedded memory, and flexible I/O in an industrial-grade Stratix III FPGA package. It is well suited to engineers building compute- and data-intensive systems that require on-chip resources, configurable power/performance tradeoffs, and robust reliability features.

With family-level capabilities for DSP acceleration, memory interface support, and configuration security, this device provides a scalable platform for communications, signal processing, and embedded system designs where integration and long-term supportable technology are priorities.

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