EP3SL340H1152I4

The EP3SL340H1152I4 is a Stratix® III L field programmable gate array (FPGA) packaged in a 1152-BBGA (FCBGA) surface-mount case. It provides a high-density programmable fabric with substantial on-chip RAM and a large I/O complement for demanding industrial designs.

With 337,500 logic elements, approximately 18.8 Mbits of embedded memory and 744 I/O pins, this device targets applications that require high logic capacity, significant embedded storage, and extensive peripheral connectivity while operating over a wide industrial temperature range.

Key Features

• Programmable Logic Capacity — 337,500 logic elements to implement large, complex digital designs and high-density logic integration.
• Embedded Memory — Approximately 18.8 Mbits of on-chip RAM for data buffering, lookup tables, and state storage within the FPGA fabric.
• High I/O Count — 744 I/O pins to support extensive peripheral interfacing and multi-channel signal routing.
• Power — Core voltage supply range of 860 mV to 1.15 V to match target system power rails and enable low-voltage core operation.
• Package & Mounting — 1152-BBGA (FCBGA) surface-mount package; supplier device package listed as 1152-HBGA (40×40) for high-density board integration.
• Operating Temperature — Rated for industrial operation from −40 °C to 100 °C.
• RoHS Compliant — Conforms to RoHS requirements for environmental compliance.

Typical Applications

• Industrial Control — Large logic capacity and industrial temperature rating suit programmable control, motor control interfaces, and factory automation systems.
• High-Density I/O Systems — The 744 I/O pins enable multi-channel data acquisition, interface consolidation, and complex peripheral connectivity.
• Signal Processing and Embedded Storage — Approximately 18.8 Mbits of embedded RAM supports on-chip buffering and intermediate data storage for processing pipelines.

Unique Advantages

• High Logic Integration: 337,500 logic elements provide the capacity to consolidate multiple functions into a single programmable device, reducing overall system component count.
• Substantial On-Chip Memory: Approximately 18.8 Mbits of embedded RAM minimizes external memory needs and simplifies board-level design.
• Extensive Connectivity: 744 I/O pins afford designers flexibility to interface with numerous peripherals and signal domains without external multiplexing.
• Industrial Temperature Range: Operation from −40 °C to 100 °C supports deployment in thermally demanding environments.
• Compact, High-Density Package: The 1152-BBGA (40×40) surface-mount package enables dense PCB layouts while maintaining robust connectivity.
• Low-Voltage Core Support: Core supply range of 860 mV to 1.15 V aligns with modern low-voltage system architectures to help manage power budgets.

Why Choose EP3SL340H1152I4?

The EP3SL340H1152I4 positions itself as a high-capacity, industrial-grade FPGA option for designs that demand significant logic resources, embedded memory, and broad I/O connectivity. Its combination of 337,500 logic elements and approximately 18.8 Mbits of RAM enables consolidation of complex functions on a single device, reducing BOM and simplifying system architecture.

Its industrial operating range, RoHS compliance, and compact 1152-BBGA package make it suitable for robust, space-constrained designs where long-term scalability and integration are priorities.

Request a quote or submit a procurement inquiry to receive pricing and availability for the EP3SL340H1152I4.