EP3SL340H1152C4N

The EP3SL340H1152C4N is a Stratix® III L field programmable gate array (FPGA) offering high on-chip logic density and embedded memory in a compact FCBGA package. It provides 337,500 logic elements, approximately 18.8 Mbits of embedded memory, and 744 I/O pins, delivered as a surface-mount 1152-BBGA (1152-HBGA, 40×40) device. The device is specified for commercial-grade operation with a core supply range of 0.86 V to 1.15 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Density  337,500 logic elements provide a high-capacity programmable fabric for complex digital designs.
• Embedded Memory  Approximately 18.8 Mbits of on-chip RAM support large buffering, frame storage, and intermediate data processing without immediate reliance on external memory.
• I/O Resources  744 available I/O pins enable broad interfacing options for parallel buses, multi-lane connections, and extensive peripheral connectivity.
• Power and Voltage  Core supply range of 0.86 V to 1.15 V allows integration into low-voltage system power architectures.
• Package & Mounting  Delivered in a 1152-BBGA (supplier package: 1152-HBGA, 40×40) surface-mount package suitable for high-density board layouts.
• Temperature & Grade  Commercial grade device specified for 0 °C to 85 °C operation.
• Regulatory  RoHS compliant for environmental and manufacturing conformity.

Typical Applications

• Digital Signal Processing  Large logic capacity and substantial on-chip RAM enable implementation of complex DSP algorithms and streaming data pipelines.
• High-Speed Data Acquisition  Extensive I/O count supports parallel sensor interfaces and multi-channel ADC/DAC front ends for data collection systems.
• Communications & Networking  High logic density and plentiful I/O simplify implementation of packet processing, protocol engines, and multi-lane interfaces.
• System Prototyping and Integration  The combination of logic resources, embedded memory, and a compact ball-grid package suits advanced prototype boards and space-constrained system designs.

Unique Advantages

• Highly Integrated Logic Fabric:  337,500 logic elements reduce the need for external logic devices, simplifying BOM and board complexity.
• Substantial On-Chip Memory:  Approximately 18.8 Mbits of embedded RAM enable large internal buffers and state storage without immediate external memory dependency.
• Abundant I/O:  744 I/O pins provide flexibility for multi-channel interfaces and parallel system-level connectivity, reducing multiplexing overhead.
• Compact, Surface-Mount Package:  The 1152-BBGA (40×40) package supports high-density PCB routing and compact system layouts.
• Low-Voltage Core Operation:  Core voltage range of 0.86 V to 1.15 V aligns with modern low-voltage power domains to help manage power distribution.
• Commercial-Grade and RoHS Compliant:  Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial applications and manufacturing processes.

Why Choose EP3SL340H1152C4N?

The EP3SL340H1152C4N delivers a balance of high logic density, sizable embedded memory, and extensive I/O in a compact surface-mount BGA package, making it suitable for designs that require substantial programmable resources in a constrained footprint. Its commercial-grade temperature range and RoHS compliance make it appropriate for a wide range of mainstream electronic systems.

Designers seeking to consolidate logic, reduce external component count, and implement complex data processing or multi-channel interfacing will find value in this FPGA’s resource mix and package options. The device’s voltage and thermal specifications facilitate integration into modern low-voltage system architectures while supporting standard commercial operating conditions.

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