EP3SL340H1152C4LN

The EP3SL340H1152C4LN is a Stratix® III L Field Programmable Gate Array (FPGA) IC manufactured by Intel. It delivers a high on-chip logic capacity and embedded memory in a compact, surface-mount FCBGA package for commercial-grade designs.

With 337,500 logic elements, approximately 18.8 Mbits of embedded memory, and 744 user I/Os, this device targets applications that require dense logic integration, substantial on-chip RAM, and extensive I/O connectivity while operating within a 0 °C to 85 °C commercial temperature range.

Key Features

• Core Capacity — 337,500 logic elements and 13,500 CLBs provide substantial programmable logic resources for complex designs.
• Embedded Memory — Approximately 18.8 Mbits of on-chip RAM to support data buffering, state storage, and intermediate processing without external memory.
• High I/O Count — 744 user I/Os to support dense external interfacing and multi-channel connectivity.
• Power — Supports a core voltage supply range of 860 mV to 1.15 V, enabling compatibility with low-voltage power domains.
• Package & Mounting — 1152-BBGA (FCBGA) package in a supplier device package of 1152-HBGA (40×40) designed for surface-mount PCB assembly.
• Operating Range & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant for reduced hazardous substance content.

Typical Applications

• High-density I/O systems — Use the 744 I/Os for board-level designs that require large numbers of external interfaces and signal channels.
• Compute and logic-intensive designs — Leverage 337,500 logic elements to implement complex combinational and sequential logic functions on-chip.
• Memory-intensive processing — Rely on approximately 18.8 Mbits of embedded RAM for on-chip buffering, lookup tables, and intermediate data storage.
• Compact, surface-mount implementations — The 1152-BBGA FCBGA (40×40) package supports dense PCB layouts and surface-mount assembly workflows.

Unique Advantages

• Substantial on-chip resources: Large logic element count and significant embedded memory reduce the need for external logic and RAM, simplifying system architecture.
• Extensive external connectivity: 744 user I/Os enable broad peripheral and interface support without additional multiplexing hardware.
• Compact package footprint: 1152-BBGA FCBGA in a 40×40 supplier package facilitates high-density PCB designs and surface-mount assembly.
• Low-voltage core support: Core supply range of 860 mV to 1.15 V accommodates low-voltage power domains and helps manage overall board power design.
• Commercial readiness: Commercial grade rating and RoHS compliance align the device with mainstream electronic product requirements.

Why Choose EP3SL340H1152C4LN?

The EP3SL340H1152C4LN is positioned for engineers and procurement teams needing a high-capacity Stratix® III L FPGA with extensive I/O and meaningful on-chip memory in a compact surface-mount package. Its combination of 337,500 logic elements, approximately 18.8 Mbits of embedded RAM, and 744 I/Os supports integration of complex digital functions while reducing external component count.

Backed by Intel's Stratix® III L family and offered in a 1152-BBGA (40×40) package, this commercial-grade FPGA is suited to designs that prioritize logic density, embedded memory, and dense I/O in a RoHS-compliant form factor.

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