EP3SL340H1152C4LG

The EP3SL340H1152C4LG is an Intel Stratix III family FPGA offering high logic density and programmable system integration for commercial applications. Built on the Stratix III architecture, it targets high-performance logic, digital signal processing, and embedded designs where large logic capacity, substantial on-chip memory, and flexible I/O are required.

Key Features

• Logic Capacity  Approximately 337,500 logic elements provide large-scale programmable logic resources for complex designs.
• Embedded Memory  Approximately 18.8 Mbits of on-chip RAM to support large buffering, FIFOs, and memory-centric algorithms.
• DSP and Arithmetic  Stratix III family DSP architecture supports dedicated multipliers (including 9×9, 12×12, 18×18, and 36×36 configurations) and multiply-accumulate operations for high-throughput signal processing.
• I/O and Packaging  Up to 744 user I/O pins in a modular I/O bank structure; supplied in a 1152-ball FCBGA / HBGA package (1152-HBGA, 40×40) with surface-mount mounting.
• Power and Core Voltage  Selectable core operation across a supply range of 0.86 V to 1.15 V to balance performance and power for system needs.
• Clocks and PLLs  Family-level capabilities include multiple global/regional/peripheral clocks and up to 12 PLLs for flexible clocking and clock synthesis.
• Security and Reliability  Stratix III family features include optional 256‑bit AES configuration encryption and on-chip CRC/ECC mechanisms to detect and correct configuration and memory errors.
• Temperature and Compliance  Commercial-grade operation from 0 °C to 85 °C; device is RoHS compliant.

Typical Applications

• High-performance signal processing  Use the device's large logic count and DSP resources for FIR filters, FFTs, and real-time digital signal workflows.
• Networking and communications  Modular I/O banks and high-speed SERDES support make it suitable for packet processing, protocol bridging, and network front-end tasks.
• Memory interface and buffering  Significant embedded RAM and dedicated memory interface features support controllers and buffering for DDR/DDR2/DDR3 and other external memory subsystems.
• Embedded system integration  Ideal for combining custom logic, embedded processing, and peripheral glue logic in commercial embedded platforms.

Unique Advantages

• High-density programmable fabric: 337,500 logic elements reduce the need for multiple devices and simplify board-level partitioning.
• Substantial embedded memory: Approximately 18.8 Mbits of RAM supports large on-chip buffers and memory-mapped accelerators, lowering external memory dependency.
• Flexible power/performance trade-offs: Core voltage selectable between 0.86 V and 1.15 V enables designers to tune performance versus power consumption.
• Robust I/O and packaging options: 744 user I/O and a 1152-ball FCBGA/HBGA package provide high pin count and compact footprint for dense system designs.
• Built-in security and fault detection: Support for AES encryption and ECC/CRC improves protection of intellectual property and runtime reliability.
• Clocking and DSP resources: Multiple clock domains, numerous PLLs, and dedicated multipliers accelerate timing- and compute-intensive functions.

Why Choose EP3SL340H1152C4LG?

The EP3SL340H1152C4LG brings Stratix III family capabilities to commercial designs that demand large logic capacity, significant on-chip memory, and flexible I/O in a single, surface-mount FCBGA/HBGA package. Its combination of programmable power options, DSP resources, and built-in reliability/security features make it well suited for high-throughput signal processing, advanced networking, and complex embedded integration.

For design teams requiring a scalable FPGA platform with series-level support for embedded processors and megafunctions, this device provides a robust foundation that balances performance, integration, and commercial operating conditions.

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