EP3SL340H1152C3

The EP3SL340H1152C3 is an Intel Stratix® III L field programmable gate array (FPGA) supplied in a 1152‑ball BGA (FCBGA) package. It delivers high logic capacity and embedded memory in a surface‑mount form factor suitable for commercial temperature applications.

With 337,500 logic elements, approximately 18.8 Mbits of embedded memory, and 744 I/O pins, this device targets designs that require dense programmable logic, substantial on‑chip RAM, and a high I/O count while operating at a core voltage range of 0.86 V to 1.15 V.

Key Features

• Logic Capacity  337,500 logic elements provide extensive programmable fabric for complex logic, datapath, and control implementations.
• Embedded Memory  Approximately 18.8 Mbits of on‑chip RAM for buffering, FIFOs, and memory‑intensive functions without external memory dependency.
• I/O Density & Package  744 available I/O pins in a 1152‑BBGA (FCBGA) package, with supplier device package listed as 1152‑HBGA (40×40), enabling high‑pin‑count system interfaces in a compact package.
• Power & Core Voltage  Core voltage supply range of 860 mV to 1.15 V to match system power architectures and optimize power/performance tradeoffs.
• Thermal & Mounting  Surface‑mount package with a commercial operating temperature range of 0 °C to 85 °C for standard commercial deployments.
• Compliance  RoHS‑compliant construction for environmental and regulatory alignment.

Unique Advantages

• High logic density: 337,500 logic elements allow consolidation of complex functions onto a single device, reducing board count and interconnect complexity.
• Substantial on‑chip memory: Approximately 18.8 Mbits of embedded RAM supports large buffers, packet queues, and local data storage without immediate need for external memory.
• Extensive I/O capability: 744 I/O pins enable multiple high‑pin interfaces and flexible board routing for complex system integration.
• Compact, high‑pin package: 1152‑BBGA (40×40) packaging balances pin count and PCB footprint for space‑constrained designs.
• Commercial temperature rating: 0 °C to 85 °C operation fits a wide range of commercial and enterprise applications.
• RoHS compliant: Facilitates regulatory compliance and easier integration into global supply chains.

Why Choose EP3SL340H1152C3?

The EP3SL340H1152C3 combines very large programmable logic capacity, significant on‑chip memory, and a high I/O count within a compact BGA package, making it suitable for designs that require dense logic integration and flexible I/O. Its core voltage range and commercial temperature rating align with standard system power domains and operating environments.

This device is appropriate for engineering teams seeking to consolidate multiple functions onto a single FPGA, reduce component count, and take advantage of large embedded RAM resources while maintaining RoHS compliance and a surface‑mount package footprint.

Request a quote or submit an inquiry to receive pricing and availability information for the EP3SL340H1152C3.