EP3SL340H1152C2G

The EP3SL340H1152C2G is a Stratix III family FPGA offering high logic density and extensive I/O capability in a 1152-ball BGA package for surface-mount applications. Designed for high-performance logic, DSP and embedded system integration, it delivers a combination of large programmable logic resources, substantial embedded memory, and flexible I/O for demanding commercial designs.

With selectable core voltage and programmable power features described for the Stratix III family, this device targets applications that require scalable performance, on-chip memory and abundant connectivity while operating within a commercial temperature range.

Key Features

• High logic density  Approximately 337,500 logic elements to implement complex logic, control and processing functions on a single device.
• Embedded memory  Approximately 18.8 Mbits of on-chip RAM (total RAM bits: 18,822,144) for buffering, FIFOs and memory-centric functions.
• Extensive I/O  744 user I/O pins provide broad external connectivity for high-pin-count systems and modular I/O bank architectures described for the Stratix III family.
• Package and mounting  1152-BBGA (1152-HBGA, 40×40) FCBGA surface-mount package optimized for high-density board designs.
• Core voltage range  Selectable core operation from 0.86 V to 1.15 V to support power/performance trade-offs.
• Commercial temperature grade  Rated for 0 °C to 85 °C operation suitable for commercial environments.
• Stratix III family architecture  Family-level capabilities include Programmable Power Technology, multi-clock domains, PLLs, high-speed DSP blocks and TriMatrix memory structures.
• Security & reliability  Family features include optional 256-bit AES encryption for configuration security and on-chip CRC/ECC circuitry for configuration and memory integrity.

Typical Applications

• High-performance logic and control  Implement complex control, state machines and custom datapaths using the device’s large pool of logic elements and clock resources.
• Digital signal processing  Leverage Stratix III family DSP resources and embedded memory for FIR filters, multiply-accumulate functions and other DSP tasks.
• Memory interface and buffering  Use the ample on-chip RAM and modular I/O banks to build DDR/DDR2/DDR3 and other high-speed memory interfaces and buffering solutions.
• High-speed communications  Support networking and communications protocols with the family’s high-speed differential I/O, SERDES and dynamic phase alignment capabilities.

Unique Advantages

• Large single-chip integration:  Combines roughly 337,500 logic elements and ~18.8 Mbits of embedded memory to reduce external components and simplify system architecture.
• Flexible power/performance trade-offs:  Selectable core voltage and Programmable Power Technology enable designers to tune the device for higher performance or lower power consumption.
• Robust I/O and packaging:  744 user I/Os in a 1152-ball BGA package provide the pin count and board density needed for complex, I/O-heavy designs.
• Built-in system reliability:  Family features such as configuration CRC and ECC-protected memory help detect and mitigate soft errors in critical designs.
• Security options:  Support for 256-bit AES configuration encryption provides protection for intellectual property and secure boot implementations.

Why Choose EP3SL340H1152C2G?

The EP3SL340H1152C2G positions itself as a high-density, commercially graded Stratix III FPGA suitable for designers needing substantial on-chip logic, memory and I/O in a single surface-mount package. Its combination of selectable core voltage, family-level power optimizations and reliability/security features make it appropriate for advanced embedded, DSP and high-speed communication applications.

For teams building complex systems that benefit from scalability, integrated memory and broad connectivity, this device provides a platform that aligns with Stratix III family capabilities and the practical needs of commercial product development.

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