EP3SL340F1760I4LN

The EP3SL340F1760I4LN is an Intel Stratix® III L Field Programmable Gate Array (FPGA) supplied in a 1760-FCBGA package. It delivers 337,500 logic elements, approximately 18.8 Mbits of embedded memory, and 1,120 I/Os for designs that require substantial logic capacity and extensive I/O connectivity.

Designed for industrial applications, this surface-mount device operates from 860 mV to 1.15 V and across an operating temperature range of −40 °C to 100 °C. The 1760-FCBGA (42.5×42.5) package provides a high-density footprint while meeting RoHS compliance requirements.

Key Features

• Core Logic  Provides 337,500 logic elements for implementing complex digital functions and large-scale logic integration.
• Embedded Memory  Approximately 18.8 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic blocks.
• I/O Density  1,120 I/Os to support wide parallel interfaces, multiple channels, and high-pin-count connectivity requirements.
• Power  Nominal supply range 860 mV to 1.15 V to match platform power rails and system design constraints.
• Package & Mounting  1760-FCBGA (42.5×42.5) package in a surface-mount format for compact, high-density board designs.
• Temperature & Grade  Industrial-grade device rated for −40 °C to 100 °C operation for thermally demanding environments.
• Compliance  RoHS compliant to support regulated electronics manufacturing requirements.

Typical Applications

• High-density digital processing  Use where a large logic fabric (337,500 logic elements) is required to implement complex processing, custom pipelines, or FPGA-based accelerators.
• Memory-intensive subsystems  Embedded systems that need substantial on-chip RAM for buffering, packet storage, or state machines can leverage the approximately 18.8 Mbits of memory.
• I/O-rich interface hubs  Suitable for designs requiring many parallel interfaces or channelized connectivity thanks to 1,120 available I/Os.
• Industrial control and automation  Industrial-grade temperature rating and robust packaging make it appropriate for industrial controllers and automation equipment.

Unique Advantages

• Substantial logic capacity: 337,500 logic elements enable consolidation of multiple functions into a single FPGA, reducing component count.
• On-chip memory for system performance: Approximately 18.8 Mbits of embedded RAM supports high-throughput buffering and local data storage without external memory.
• Extensive I/O connectivity: 1,120 I/Os allow broad interface support and high channel counts for complex systems.
• Industrial-grade operating range: Rated from −40 °C to 100 °C to meet temperature requirements for industrial deployments.
• High-density FCBGA package: The 1760-FCBGA (42.5×42.5) package supports compact PCB layouts while providing a large pin count.
• Environmental compliance: RoHS compliance supports environmentally regulated manufacturing processes.

Why Choose EP3SL340F1760I4LN?

The EP3SL340F1760I4LN positions itself as a high-capacity FPGA option within the Stratix® III L family, balancing large logic resources, significant embedded memory, and a very high I/O count in a single industrial-grade package. Its electrical and thermal specifications make it suitable for demanding embedded applications that require consolidation of multiple functions onto one programmable device.

Engineers and procurement teams seeking a robust, high-density FPGA for industrial designs will find the combination of logic elements, on-chip RAM, and extensive I/O advantageous for reducing BOM complexity and supporting scalable system architectures, all backed by Intel as the manufacturer.

Request a quote or submit an inquiry to obtain pricing, lead time, and availability for the EP3SL340F1760I4LN.