EP3SL340F1760I4N

The EP3SL340F1760I4N is a Stratix® III L field programmable gate array (FPGA) IC from Intel, designed for high-density programmable logic applications. It combines a large logic fabric, substantial embedded memory, and extensive I/O capacity in a 1760-FCBGA package for industrial-grade deployments.

This device is suited to designs that require dense integration and robust operation, offering a balance of logic capacity, on-chip RAM, and I/O resources while operating over an industrial temperature range and a defined core voltage supply window.

Key Features

• High Logic Capacity 337,500 logic elements provide a large programmable fabric for complex logic, control, and data-path functions.
• Embedded Memory Approximately 18.8 Mbits of on-chip RAM to support buffers, FIFOs, and embedded data storage without external memory for many functions.
• Extensive I/O 1,120 I/O pins enable wide bus interfaces, multi-channel connectivity, and large-system integration.
• Power Envelope Core voltage supply range from 860 mV to 1.15 V to match system power architectures and allow for controlled power planning.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C and specified as Industrial grade for use in demanding environments.
• Robust Package 1760-FCBGA package (1760-BBGA, supplier package 1760-FCBGA, 42.5 × 42.5 mm) with surface-mount mounting type for compact board-level integration.
• RoHS Compliant Conforms to RoHS requirements for reduced hazardous substances.

Unique Advantages

• High-density programmable fabric: 337,500 logic elements deliver the capacity to implement large custom logic and complex state machines on a single device, reducing the need for multiple components.
• Significant embedded memory: Approximately 18.8 Mbits of on-chip RAM enable efficient data buffering and on-chip storage, minimizing external memory dependencies.
• Wide I/O capability: 1,120 I/O pins support broad interfacing options for parallel buses, multi-lane interfaces, and dense peripheral connections.
• Industrial robustness: Rated for −40 °C to 100 °C operation and specified as Industrial grade to meet system reliability requirements in challenging environments.
• Compact system integration: 1760-FCBGA package in a 42.5 × 42.5 mm footprint simplifies board layout while accommodating high pin count and thermal considerations.
• Defined power requirements: Core supply range of 860 mV to 1.15 V supports precise power budgeting and thermal design.

Why Choose EP3SL340F1760I4N?

The EP3SL340F1760I4N positions itself as a high-density Stratix® III L FPGA from Intel, combining large logic capacity, substantial embedded memory, and extensive I/O in a single industrial-grade FCBGA package. Its specification set supports designs that need dense on-chip resources and dependable operation across a wide temperature range.

Engineers and procurement teams looking for a scalable, high-capacity programmable device for industrial applications will find this part provides a solid balance of integration, performance headroom, and package-level connectivity for complex system designs.

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