EP3SL340H1152C2N

The EP3SL340H1152C2N is a Stratix® III L Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1152-ball BGA package. It provides a high logic capacity and substantial on-chip memory with a large count of user I/Os, making it suitable for designs that require dense logic integration and extensive external connectivity.

Key attributes include 337,500 logic elements, approximately 18.8 Mbits of embedded memory, support for a wide I/O count, and a low-voltage core supply range, all in a surface-mount BGA package graded for commercial temperature operation.

Key Features

• Logic Capacity — 337,500 logic elements to implement complex, high-density digital designs.
• Embedded Memory — Approximately 18.8 Mbits of on-chip RAM for buffering, lookup tables, and state storage within the FPGA fabric.
• I/O Count — 744 user I/Os to support wide external interfacing and parallel connectivity requirements.
• Power Supply — Core voltage supply range from 860 mV to 1.15 V, enabling designs targeting low-voltage FPGA core operation.
• Package & Mounting — 1152-BBGA (FCBGA) package; supplier device package listed as 1152-HBGA (40×40). Surface-mount construction suitable for standard PCB assembly.
• Operating Temperature & Grade — Commercial grade with an operating range of 0 °C to 85 °C for typical commercial applications.
• Regulatory — RoHS-compliant construction.

Typical Applications

• High-density digital systems — Implement wide, complex logic functions and custom datapaths using the FPGA's large logic capacity.
• Memory-intensive designs — Leverage approximately 18.8 Mbits of embedded RAM for buffering, FIFOs, and on-chip data storage.
• High-pin-count interfaces — Use the 744 I/Os to connect to multiple peripherals, parallel buses, or multi-channel front-ends.

Unique Advantages

• High logic density: 337,500 logic elements reduce the need for external glue logic when implementing complex systems on a single FPGA.
• Substantial on-chip RAM: Approximately 18.8 Mbits of embedded memory supports data buffering and local storage without added external memory.
• Extensive I/O capacity: 744 user I/Os enable broad connectivity to sensors, interfaces, and daughtercards.
• Compact BGA packaging: 1152-ball BGA (40×40) provides a high-density pinout in a surface-mount form factor for space-constrained PCBs.
• Low-voltage core operation: Core supply range from 0.86 V to 1.15 V supports designs optimized for lower power domains.
• RoHS-compliant: Meets lead-free requirements for environmentally compliant assemblies.

Why Choose EP3SL340H1152C2N?

The EP3SL340H1152C2N positions itself as a solution for engineers needing a high-capacity FPGA with substantial embedded memory and a large number of I/Os in a compact BGA package. Its commercial-grade temperature range and surface-mount BGA footprint make it suitable for a broad range of commercial electronic systems.

Choose this FPGA when your design requires dense logic resources, significant on-chip RAM, and many external connections while maintaining a compact board footprint and RoHS compliance.

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