EP3SL340F1760I4LG

The EP3SL340F1760I4LG is an Intel Stratix III family FPGA offering high-density programmable logic and embedded memory for demanding logic, DSP, and embedded applications. It combines a large logic capacity and substantial on-chip RAM with a wide I/O count and selectable core-voltage operation to support performance-focused system designs in industrial environments.

Key Features

• Logic Capacity  Approximately 337,500 logic elements for complex digital designs and large-scale integration.
• Embedded Memory  Approximately 18.8 Mbits of on-chip RAM to implement FIFOs, buffers, and data-path storage.
• I/O Density  1,120 user I/O pins to support wide parallel interfaces and modular I/O bank architectures.
• High‑Performance DSP  Stratix III family DSP capabilities include dedicated multiplier blocks and FIR-friendly resources for signal-processing workloads.
• Clocking and PLLs  Family-level support includes multiple global, regional, and peripheral clocks plus up to 12 PLLs for flexible clock synthesis and distribution.
• Power and Core Voltage  Operates with a core supply range of 0.86 V to 1.15 V and leverages family-level programmable power features for performance vs. power tradeoffs.
• Package & Mounting  1760-FCBGA package (42.5 × 42.5 mm), surface-mount mounting for high-pin-count, board-level integration.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation to meet industrial deployment requirements.
• Security & Reliability  Stratix III family features include optional AES-256 configuration-bitstream security and on-chip error detection and correction for configuration and memory integrity.
• Standards & Compliance  RoHS compliant.

Typical Applications

• High‑Performance Logic Systems  Large-scale control and data-path implementations that require extensive programmable logic and routing resources.
• Digital Signal Processing  DSP-heavy applications that use on-chip multipliers and embedded RAM for filtering, transforms, and accelerator functions.
• High‑Speed Communications & Networking  Implementations that need dense I/O and flexible clocking for protocol interfaces and packet-processing engines.
• Memory Interface Controllers  Designs requiring robust on-chip memory and dedicated I/O support for DDR/DDR2/DDR3 and other external memory interfaces.

Unique Advantages

• High integration density: Large logic-element count and substantial embedded memory reduce external component count and simplify system architecture.
• Flexible I/O capability: Over 1,100 I/O pins enable broad interfacing options for parallel buses, high-speed links, and modular I/O bank routing.
• Configurable power/performance: Core voltage range and family programmable power techniques allow designers to tune for performance or lower power consumption.
• Industrial readiness: Surface-mount FCBGA package and −40 °C to 100 °C operating range support deployment in industrial environments.
• Built-in reliability and security: On-chip ECC, CRC error detection, and optional AES-256 configuration protection contribute to robust long-term operation.
• Ecosystem and family features: Family-level clocking, PLLs, and DSP resources provide a flexible platform for migration and scalable design reuse.

Why Choose EP3SL340F1760I4LG?

The EP3SL340F1760I4LG positions itself as a high-density Stratix III FPGA option for engineers who need significant logic and memory resources combined with extensive I/O and industrial temperature support. Its mix of programmable power options, family-level clocking and DSP features, and on-chip reliability/security functions make it suitable for complex digital processing, communications, and embedded acceleration tasks.

This device is appropriate for development teams and system integrators targeting scalable, performance-oriented FPGA solutions with long-term deployment in industrial settings, backed by the Stratix III feature set.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for EP3SL340F1760I4LG.