EP3SL340F1760I3N

The EP3SL340F1760I3N is a Stratix® III L field programmable gate array (FPGA) offered in a 1760-BBGA / FCBGA package. It integrates high logic density, substantial on-chip RAM, and a large I/O count to address demanding industrial embedded designs.

With 337,500 logic elements, approximately 18.8 Mbits of embedded memory, and 1,120 I/Os, this FPGA targets applications that require dense logic integration, flexible I/O connectivity, and operation across an industrial temperature range. The device is RoHS compliant and supplied in a surface-mount 1760-FCBGA package.

Key Features

• Core Density  Provides 337,500 logic elements to implement complex digital functions and high-density designs.
• Embedded Memory  Includes approximately 18.8 Mbits of on-chip RAM to support buffering, packet storage, and local data processing.
• I/O Capacity  Offers 1,120 I/O pins for broad connectivity to peripherals, high-speed interfaces, and multi-channel systems.
• Package and Mounting  Supplied in a 1760-BBGA / FCBGA package (supplier device package: 1760-FCBGA (42.5×42.5)) designed for surface-mount assembly.
• Power  Operates from a core supply range of 860 mV to 1.15 V to match system power constraints.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for use in industrial environments.
• Regulatory  RoHS compliant for alignment with lead-free manufacturing and environmental requirements.

Typical Applications

• Industrial Control Systems  Use the device's industrial temperature rating and high I/O count for motor control, PLC interfaces, and factory automation I/O aggregation.
• Data Communications  Leverage the large logic fabric and abundant I/Os for packet processing, protocol bridging, and custom interface implementations.
• Signal Processing  Implement buffering and processing algorithms using the substantial on-chip RAM and dense logic resources for real-time data handling.

Unique Advantages

• High Logic Density: 337,500 logic elements enable consolidation of multiple functions into a single device, reducing board-level BOM.
• Significant Embedded Memory: Approximately 18.8 Mbits of on-chip RAM support local storage and high-throughput data paths without external memory.
• Extensive I/O Resources: 1,120 I/Os provide flexibility to connect numerous peripherals and interfaces directly to the FPGA.
• Industrial Reliability: Rated from −40 °C to 100 °C to meet temperature demands of industrial deployments.
• Compact Surface-Mount Package: 1760-FCBGA packaging offers a high-density solution for space-constrained boards.
• RoHS Compliance: Supports lead-free manufacturing requirements for compliant product assembly.

Why Choose EP3SL340F1760I3N?

The EP3SL340F1760I3N balances high logic capacity, ample embedded memory, and extensive I/O in a single industrial-grade FPGA package. Its combination of 337,500 logic elements and roughly 18.8 Mbits of RAM suits developers aiming to integrate complex digital functions while maintaining board-level compactness.

This device is appropriate for engineering teams building industrial controls, communications hardware, and signal-processing systems that require dependable thermal performance, flexible I/O, and RoHS-compliant components. Its packaging and electrical characteristics support scalable designs and long-term deployment in constrained or rugged environments.

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