EP3SL340F1760C4LN

The EP3SL340F1760C4LN is a Stratix® III L field programmable gate array (FPGA) in a 1760‑ball FCBGA package designed for commercial‑grade applications. It provides a high density of programmable logic, substantial on‑chip RAM, and a large number of I/O for complex digital designs that require integration of logic, memory, and I/O resources.

Key Features

• Core Logic  Provides 337,500 logic elements to implement large-scale digital functions and custom processing pipelines.
• Embedded Memory  Approximately 18.8 Mbits of on‑chip RAM for buffering, lookup tables, and intermediate data storage.
• I/O Capacity  1,120 I/O pins to support high‑pin‑count interfaces, multi‑lane connectivity, and broad peripheral integration.
• Power Supply  Operates from supply rails in the range of 860 mV to 1.15 V, enabling compatibility with targeted core voltage domains.
• Package and Mounting  Supplied in a 1760‑FCBGA (42.5 × 42.5 mm) surface‑mount package for compact board integration and thermal conduction.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C for standard commercial deployments.
• Compliance  RoHS compliant for adherence to standard environmental requirements in commercial electronics.

Typical Applications

• High‑density digital processing  Use the large logic capacity and on‑chip memory for custom accelerators, signal processing pipelines, and arithmetic engines.
• Networking and communications  Leverage the high I/O count to implement multi‑lane interfaces, protocol bridging, and packet processing functions.
• Prototyping and system integration  Ideal for system designers who need a programmable platform with extensive logic and memory to validate and integrate complex subsystems.
• Interface and I/O aggregation  Aggregate multiple sensor, peripheral, or transceiver channels where many I/O signals and on‑chip buffering are required.

Unique Advantages

• High logic density: 337,500 logic elements enable implementation of large, multi‑function designs on a single device, reducing system BOM.
• Substantial embedded RAM: Approximately 18.8 Mbits of on‑chip memory minimizes external memory needs for many buffering and table storage tasks.
• Extensive I/O capability: 1,120 I/O pins provide flexibility to connect numerous peripherals, interfaces, and high‑pin‑count daughtercards.
• Compact, manufacturable package: 1760‑FCBGA surface‑mount format offers a dense footprint for board space constrained designs while supporting standard PCB assembly.
• Commercial readiness: Specified for 0 °C to 85 °C operation and RoHS compliance for use in typical commercial electronic products.

Why Choose EP3SL340F1760C4LN?

The EP3SL340F1760C4LN positions itself as a commercially graded, high‑density FPGA solution that combines a large logic fabric, significant embedded memory, and very high I/O capacity in a single 1760‑FCBGA package. It is well suited for designers who need to consolidate complex logic, buffering, and multi‑channel interfaces into a single programmable device.

This device delivers long‑term value through integration and scalability for commercial systems, enabling developers to reduce component count and streamline board-level design while working within standard commercial temperature and supply constraints.

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