EP3SL340F1760I3

The EP3SL340F1760I3 is an Intel Stratix® III L field-programmable gate array (FPGA) in a 1760-FCBGA surface-mount package. It delivers very high logic capacity and on-chip memory with extensive I/O density for complex, memory- and interface-heavy digital designs.

Designed for industrial applications, the device supports a core supply range of 0.86 V to 1.15 V and an operating temperature range of -40 °C to 100 °C, offering a balance of performance, integration, and environmental robustness.

Key Features

• High Logic Capacity  337,500 logic elements to implement large-scale digital logic and complex processing blocks.
• Embedded Memory  Approximately 18.82 Mbits of on-chip RAM for buffering, lookup tables, and data-path storage without relying solely on external memory.
• Extensive I/O  1,120 I/O pins to support wide parallel interfaces and multiple high-density connections.
• Core Supply Flexibility  Core voltage support from 0.86 V to 1.15 V to align with system power architectures and enable power-optimized designs.
• Industrial Temperature Range  Rated for -40 °C to 100 °C operation to meet industrial environmental requirements.
• Compact FCBGA Package  1760-FCBGA package (42.5 × 42.5 mm) in a surface-mount format for high-density board integration.
• RoHS Compliant  Conforms to RoHS requirements for lead-free assembly and environmental compliance.

Typical Applications

• High-density digital processing  Implement complex finite-state machines, data-paths, and custom accelerators using large logic and memory resources.
• Networking and communications  Support wide parallel interfaces and packet processing with abundant I/O and embedded RAM for buffering.
• Embedded system integration  Consolidate peripherals and bridge multiple interfaces on a single device thanks to high I/O count and logic density.
• Industrial control and automation  Use in controllers and signal-processing modules that require industrial temperature operation and robust packaging.

Unique Advantages

• High integration density: Consolidate multiple functions on-chip with 337,500 logic elements to reduce external components and board complexity.
• Significant on-chip memory: Approximately 18.82 Mbits of embedded RAM lowers dependence on external memory and simplifies data-path design.
• Large I/O capability: 1,120 I/Os enable flexible partitioning of system interfaces and high-bandwidth parallel connections.
• Designed for industrial environments: Industrial grade and -40 °C to 100 °C operating range support deployments in harsh environments.
• Space-efficient package: 1760-FCBGA (42.5 × 42.5 mm) surface-mount package balances density and board-level integration.
• RoHS compliance: Meets environmental requirements for lead-free manufacturing.

Why Choose EP3SL340F1760I3?

The EP3SL340F1760I3 positions itself as a high-density, industrial-grade Stratix® III L FPGA suitable for designers who need substantial logic resources, on-chip memory, and broad I/O capability within a compact FCBGA package. Its core supply range and wide operating temperature make it a practical choice for power-sensitive and environmentally demanding applications.

Choose this part when you need to consolidate complex digital functions, support multiple interfaces, and maintain system robustness over industrial temperature ranges while benefiting from Intel's Stratix III L architecture and a high-density surface-mount package.

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