EP3SL340F1760I3G

The EP3SL340F1760I3G is an Intel Stratix III family FPGA delivered in a 1760-pin FCBGA package, designed for high‑density logic, DSP and memory‑centric embedded designs. The device combines 337,500 logic elements with approximately 18.8 Mbits of on‑chip RAM and up to 1,120 user I/Os to address demanding applications that need large programmable fabric, extensive I/O and flexible power options.

Built for industrial operating ranges and RoHS compliance, the device supports selectable core voltages and advanced on‑chip features from the Stratix III series to simplify system integration for communications, signal processing and high‑performance logic designs.

Key Features

• High‑density logic — 337,500 logic elements provide ample programmable fabric for large-scale state machines, glue logic and custom datapaths.
• Embedded memory — Approximately 18.8 Mbits of on‑chip RAM to implement FIFOs, buffers and memory‑mapped structures without immediate external memory dependence.
• Extensive I/O — 1,120 user I/Os in a modular I/O bank structure to support a wide range of interface standards and flexible pin assignments.
• High‑speed I/O and SERDES — Stratix III series I/O architecture includes high‑speed differential support and SERDES with dynamic phase alignment for high‑performance serial links as described in the device family documentation.
• DSP capabilities — Series DSP block support for dedicated multipliers and MAC functions suitable for FIR filters and signal processing tasks (per Stratix III family details).
• Programmable power and core voltage — Selectable core voltage operation (0.86 V to 1.15 V supply range) and power management features that enable designers to balance performance and power consumption.
• Security and reliability — Series features include optional 256‑bit AES encryption and configuration memory error detection/correction mechanisms to protect and validate device configuration (as provided in family documentation).
• Package and mounting — 1760‑FCBGA package (42.5 × 42.5 mm), surface‑mount for compact system integration.
• Industrial temperature range — Rated for −40°C to 100°C operation, suitable for industrial environments.
• Standards and compliance — RoHS compliant per product data.

Typical Applications

• High‑performance networking — Implement packet processing, protocol offload or custom interface bridging using the device’s large logic count and high‑speed I/O capabilities.
• Digital signal processing — Deploy FIR filters, FFTs and other DSP workloads using on‑die multipliers and memory resources for low‑latency processing.
• Memory interface controllers — Use embedded RAM and modular I/O banks to build controllers and interfaces for external memory subsystems.
• Prototyping and system integration — Integrate complex system logic, accelerators and custom peripherals in a single FPGA fabric to reduce board-level BOM and simplify integration.

Unique Advantages

• Large programmable fabric: 337,500 logic elements enable integration of complex logic and multiple subsystems on a single device, reducing external components.
• Significant embedded memory: Approximately 18.8 Mbits of on‑chip RAM lets designers implement internal buffering and memory structures without immediate external memory.
• Flexible power scaling: Support for a core supply range of 0.86 V to 1.15 V allows designers to trade off performance and power according to system needs.
• Industrial robustness: −40°C to 100°C operating range and surface‑mount FCBGA packaging support deployment in industrial applications.
• Security and reliability features: Family‑level support for AES encryption and configuration memory error detection/correction helps protect designs and improve availability.

Why Choose EP3SL340F1760I3G?

The EP3SL340F1760I3G places large-scale Stratix III FPGA capability into a 1760‑pin FCBGA package suited for industrial deployments. With hundreds of thousands of logic elements, multi‑megabit embedded RAM, extensive I/O and family features for DSP, clocking and security, this device is positioned for designs that require dense integration of processing, high‑speed interfaces and robust configuration control.

This part is appropriate for engineering teams building communications, signal processing, memory interface or system‑level prototypes and products that benefit from a balance of logic capacity, embedded memory and flexible power/clock management offered by the Stratix III family.

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