EP3SL340F1760I4G

The EP3SL340F1760I4G is a Stratix III family Field Programmable Gate Array designed for high-density, high-performance digital logic and signal processing applications. It combines a large logic fabric with substantial embedded memory and extensive I/O to support complex system integration.

With approximately 337,500 logic elements, roughly 18.8 Mbits of embedded memory, and 1,120 I/O pins in a 1760‑FCBGA package, this industrial‑grade, surface‑mount device targets demanding applications that require scalable logic capacity, on‑chip memory, and robust operating range from −40 °C to 100 °C.

Key Features

• Core & Architecture  Stratix III family architecture with approximately 337,500 logic elements for high-density logic implementation.
• Embedded Memory  Approximately 18.8 Mbits of on‑chip RAM to support large FIFOs, buffers, and data storage without immediate reliance on external memory.
• DSP and Arithmetic  Family-level support for dedicated high‑speed DSP blocks and multiple multiplier sizes (9×9, 12×12, 18×18, 36×36) suitable for signal processing and compute‑intensive tasks.
• I/O Capacity  1,120 user I/O pins to accommodate wide parallel interfaces and complex board-level routing.
• Power and Core Voltage  Supported voltage range of 860 mV to 1.15 V for core supply, enabling selectable core operation within that range.
• Package & Mounting  1760‑FCBGA package (1760‑BBGA) with a 42.5 mm × 42.5 mm footprint; surface‑mount mounting type for standard PCB assembly.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Reliability & Compliance  RoHS‑compliant device; family documentation describes built‑in configuration CRC and ECC support for memory integrity (refer to manufacturer datasheet for family details).

Typical Applications

• High‑performance DSP systems  Implement complex filtering, FIR/IIR processing, and real‑time signal chains using the device's dedicated DSP resources and large logic capacity.
• Networking and Communications  Build protocol engines, packet processors, and interface bridging with abundant I/O and programmable logic for custom link handling.
• Memory interface controllers  Develop controllers and PHY logic for high‑speed external memories using on‑chip memory for buffering and timing control.
• Embedded system prototyping  Integrate custom processors, accelerators, and peripheral logic into a single FPGA for system validation and product development.

Unique Advantages

• High logic density: Large logic element count lets you consolidate complex functions into one device, reducing part count and PCB complexity.
• Substantial on‑chip memory: Approximately 18.8 Mbits of embedded RAM supports large FIFOs and local data buffering, lowering dependence on external memory.
• Extensive I/O availability: 1,120 I/O pins enable broad interfacing options for parallel buses, sensors, and multi‑lane data paths.
• Industrial thermal range: Rated −40 °C to 100 °C to meet durability requirements for industrial deployments.
• Package suitable for dense boards: 1760‑FCBGA (42.5×42.5 mm) enables dense integration while supporting standard surface‑mount assembly processes.
• Design integrity features: Family‑level support for configuration CRC and ECC mechanisms improves system availability and error detection.

Why Choose EP3SL340F1760I4G?

The EP3SL340F1760I4G brings a combination of high logic capacity, significant embedded memory, and wide I/O capability in an industrial‑grade Stratix III FPGA package. It is well suited for engineers building compute‑intensive, data‑centric, and interface‑rich systems that require on‑device memory and configurable DSP resources.

Choosing this device supports designs that need scalable performance, robust operating temperature range, and a compact FCBGA footprint, while leveraging Stratix III family architectural features documented in the manufacturer’s technical references.

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