EP3SL340F1760C4L

The EP3SL340F1760C4L is a Stratix® III L Field Programmable Gate Array (FPGA) IC from Intel in a 1760-ball FCBGA surface-mount package. It delivers 337,500 logic elements, approximately 18.8 Mbits of embedded memory, and 1,120 I/O pins—providing the on-chip resources required for large, high-density digital designs.

The device is specified for commercial operation with a supply range of 860 mV to 1.15 V and an operating temperature range of 0 °C to 85 °C, and it is RoHS compliant.

Key Features

• Core Logic Approximately 337,500 logic elements for implementing complex combinational and sequential logic within a single device.
• Embedded Memory Approximately 18.8 Mbits of on‑chip RAM to support buffering, lookup tables, and state storage without immediate reliance on external memory.
• I/O Capacity 1,120 I/O pins to support high pin-count interfaces and multiple parallel channels.
• Power Specified core supply range of 860 mV to 1.15 V to align with system power-rail planning.
• Package & Mounting 1760-FCBGA (42.5 × 42.5) package in a surface-mount form factor for high pin density in compact PCB layouts.
• Temperature & Grade Commercial grade device specified to operate from 0 °C to 85 °C.
• Environmental Compliance RoHS compliant for regulatory and manufacturing requirements.

Typical Applications

• High-density digital systems — Use the device's large logic element count and embedded memory to consolidate complex logic, protocol bridges, or multi-function controllers into a single FPGA.
• Multi-channel I/O designs — 1,120 I/Os accommodate designs with numerous parallel interfaces, sensor arrays, or multi-lane connectivity requirements.
• On-chip buffering and storage — Approximately 18.8 Mbits of embedded RAM supports frame buffering, FIFO staging, and LUT-based implementations without immediate external memory.

Unique Advantages

• High logic capacity: 337,500 logic elements enable integration of multiple subsystems and complex state machines on one FPGA, reducing board-level partitioning.
• Substantial embedded memory: Approximately 18.8 Mbits of on-chip RAM decreases dependence on external memory devices and simplifies memory architectures.
• Extensive I/O resources: 1,120 I/Os provide flexibility for large interface counts and direct connections to peripherals and parallel buses.
• Compact, high-density package: 1760-FCBGA (42.5 × 42.5) offers high pin density in a standard surface-mount format for space-constrained designs.
• Commercial temperature and RoHS compliance: Specified 0 °C to 85 °C operation and RoHS compliance support mainstream product development and manufacturing requirements.

Why Choose EP3SL340F1760C4L?

EP3SL340F1760C4L combines a large pool of logic elements, significant embedded memory, and extensive I/O in a single Intel FPGA package, making it suitable for engineers seeking to consolidate complex digital functions onto one device. The 1760-FCBGA surface-mount package provides high pin density for designs that require many external connections within a compact footprint.

With a defined supply voltage range and commercial temperature rating, this RoHS-compliant FPGA fits mainstream electronic applications where on-chip resources and I/O capacity drive system integration and board-level simplification.

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