EP3SL340F1760C4

The EP3SL340F1760C4 is an Intel Stratix® III L Field Programmable Gate Array (FPGA) supplied in a 1760-FCBGA package. It combines very large logic capacity with substantial on-chip RAM and a high I/O count for demanding commercial designs.

With 337,500 logic elements, approximately 18.8 Mbits of embedded memory and 1,120 I/O, this device targets high-density digital implementations that require large programmable fabric, significant embedded storage, and broad external connectivity while operating in standard commercial environments.

Key Features

• Core Logic  337,500 logic elements provide substantial programmable logic resources for complex digital designs and custom processing functions.
• Embedded Memory  Approximately 18.8 Mbits of on-chip RAM to support buffering, lookup tables and data-path storage within the FPGA fabric.
• I/O Capacity  1,120 I/O pins accommodate multiple interfaces and parallel connectivity to external devices and subsystems.
• Power Supply  Core voltage range of 860 mV to 1.15 V to meet the device’s low-voltage operating requirements.
• Package & Mounting  1760-FCBGA package (42.5 × 42.5 mm) in a surface-mount form factor for compact, board-level integration.
• Temperature & Grade  Commercial grade operation specified from 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance  RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• High-density digital systems  Implement large-scale logic and custom state machines using the device's 337,500 logic elements and extensive embedded memory.
• Multi-interface controllers  Leverage 1,120 I/O to connect and aggregate multiple external interfaces or parallel buses on a single FPGA.
• Data buffering and packet handling  Use the approximately 18.8 Mbits of on-chip RAM for buffering, packet queues or lookup tables in data-path designs.

Unique Advantages

• Highly integrated logic and memory: Combining 337,500 logic elements with approximately 18.8 Mbits of embedded RAM reduces external component count and simplifies board design.
• Extensive external connectivity: 1,120 I/O pins enable dense peripheral and interface support without additional I/O expanders.
• Compact, production-ready package: The 1760-FCBGA (42.5 × 42.5 mm) surface-mount package enables high-density PCB layouts while supporting automated assembly.
• Low-voltage core operation: Support for 860 mV to 1.15 V core supply allows integration into modern low-voltage power architectures.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with standard commercial deployments and product lifecycles.
• RoHS compliance: Meets lead-free environmental requirements for contemporary electronics manufacturing.

Why Choose EP3SL340F1760C4?

The EP3SL340F1760C4 delivers a balanced combination of large-scale programmable logic, significant on-chip memory and high I/O density in a compact FCBGA package. It is positioned for commercial designs that require dense logic resources and substantial embedded storage while maintaining broad external connectivity.

This device is suitable for teams developing complex digital systems that need scalable FPGA resources, streamlined BOMs and a commercially rated component backed by Intel's Stratix® III L family pedigree.

Request a quote or submit an inquiry to evaluate EP3SL340F1760C4 for your next design project.