EP3SL340F1760C2N

The EP3SL340F1760C2N is a Stratix® III L field-programmable gate array (FPGA) from Intel, designed for high-density digital designs requiring substantial logic capacity and on-chip memory. This commercial‑grade, surface‑mount FPGA integrates 337,500 logic elements and approximately 18.8 Mbits of embedded RAM to support complex system logic and data buffering.

With 1,120 I/O pins and a 1760‑FCBGA package (42.5 × 42.5 mm), this device targets applications that demand high I/O count and large programmable fabric while operating within a 0 °C to 85 °C ambient range and a core supply of 0.860 V to 1.15 V.

Key Features

• Core Logic  337,500 logic elements provide extensive programmable fabric for implementing large-scale digital functions and custom processing pipelines.
• Embedded Memory  Approximately 18.8 Mbits of on-chip RAM for data buffering, FIFOs, and lookup tables directly within the FPGA fabric.
• I/O Capacity  1,120 I/O pins to accommodate wide parallel interfaces, multiple transceiver banks, and diverse peripheral connectivity.
• Package  1760‑FBGA / 1760‑FCBGA package (42.5 × 42.5 mm) in a surface-mount form factor for high-density board integration.
• Power  Core supply voltage range from 0.860 V to 1.15 V to match platform power architectures and enable stable core operation.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C suitable for standard commercial environments.
• RoHS Compliance  Device is RoHS compliant for environmental and regulatory alignment.

Unique Advantages

• High programmable density: 337,500 logic elements deliver the capacity to implement complex, multi-function designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 18.8 Mbits of embedded RAM reduces external memory dependence and simplifies board-level designs.
• Extensive I/O resources: 1,120 I/O pins enable broad peripheral support and parallel data paths for high-bandwidth interfaces.
• Compact, manufacturable package: 1760‑FCBGA surface-mount package (42.5 × 42.5 mm) supports automated assembly and dense PCB layouts.
• Designed for commercial systems: Commercial temperature grade and RoHS compliance align the device with typical enterprise and industrial electronics supply chains.

Why Choose EP3SL340F1760C2N?

The EP3SL340F1760C2N positions itself as a high-density Stratix® III L FPGA option for engineers who require a large logic fabric, significant embedded memory, and a very high I/O count within a single surface‑mount package. Its combination of 337,500 logic elements, roughly 18.8 Mbits of on-chip RAM, and 1,120 I/Os makes it well suited to consolidate complex functionality and reduce board-level component count.

For development teams focused on scalable, robust digital designs in commercial environments, this FPGA offers a balance of integration, capacity, and manufacturability that supports long-term design evolution and system consolidation.

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