EP3SL340F1760C2G

IC FPGA 1120 I/O 1760FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 1,141 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O1120Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs13500Number of Logic Elements/Cells337500
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits18822144

Overview of EP3SL340F1760C2G – Field Programmable Gate Array (FPGA) IC

The EP3SL340F1760C2G is a Stratix III family FPGA offering a high-density, high-performance programmable fabric suited for demanding logic, DSP and embedded designs. Built on a 65 nm SRAM process, the device combines a large logic resource set, substantial on-chip memory, and a wide complement of I/O in a 1760‑ball FCBGA package for surface-mount board integration.

Targeted at applications that require substantial logic capacity and flexible system integration, this commercial‑grade device supports selectable core voltage operation and family-level features aimed at balancing performance and power.

Key Features

  • Logic Capacity — 337,500 logic elements, delivering extensive programmable resources for complex designs and large-scale integration.
  • Embedded Memory — Approximately 18.8 Mbits of on-chip RAM to implement buffers, FIFOs and memory-hungry functions within the FPGA fabric.
  • I/O and Packaging — Up to 1,120 user I/Os in a 1760‑FCBGA package (42.5×42.5 mm) with surface-mount mounting for dense board layouts.
  • Power and Voltage — Core supply range from 0.860 V to 1.15 V with selectable core voltage support (family feature) to tune performance versus power.
  • Clocking and Timing — Family-level support for multiple global, regional and peripheral clocks plus up to 12 PLLs for clock synthesis, switchover and dynamic phase control.
  • DSP and Arithmetic Support — Family architecture provides dedicated DSP blocks for efficient implementation of multipliers and MAC operations (family-level capability).
  • Configuration Security & Reliability — Family options include 256‑bit AES configuration encryption, configuration CRC, and ECC for on-chip memory to help detect and correct configuration and memory errors.
  • Temperature & Grade — Commercial grade operation from 0 °C to 85 °C for standard embedded and system applications.

Typical Applications

  • High‑Performance DSP Systems — Implement multi-channel signal processing, FIR filters and large multiplier arrays using the device’s DSP resources and abundant logic elements.
  • Networking and Communications — Support for high-speed SERDES, modular I/O banks and programmable I/O make the device suitable for packet processing, protocol bridging and interface aggregation.
  • Memory Interface Controllers — Large embedded RAM and dedicated I/O structure enable implementations of DDR/DDR2/DDR3 controllers and memory buffering (family-level support).
  • Embedded Compute and Acceleration — Combine logic, on-chip memory and PLL resources to create custom accelerators and embedded processing subsystems.

Unique Advantages

  • High integration density: 337,500 logic elements allow consolidation of complex functions into a single device, reducing board BOM and interconnect complexity.
  • Significant on‑chip memory: Approximately 18.8 Mbits of embedded RAM supports large local buffers and data-path storage, improving latency and throughput.
  • Extensive I/O scalability: Up to 1,120 user I/Os and modular bank architecture enable flexible interface routing and multiple memory or peripheral connections.
  • Configurable power/performance tradeoffs: Selectable core voltage and family power technologies let designers tune device operation to match system constraints.
  • Built‑in security and reliability features: Support for 256‑bit AES configuration keys, CRC and ECC help protect designs and detect/correct memory or configuration errors.
  • Commercial ready packaging: 1760‑FCBGA (42.5×42.5 mm) surface-mount package supports high-density PCBs while meeting standard commercial temperature requirements.

Why Choose EP3SL340F1760C2G?

The EP3SL340F1760C2G positions itself as a high‑density Stratix III FPGA option for designers who need substantial logic capacity, large embedded memory, and flexible I/O in a single commercial‑grade package. Its combination of 337,500 logic elements, approximately 18.8 Mbits of on‑chip RAM and up to 1,120 user I/Os supports complex DSP, memory-interface and embedded compute applications without partitioning across multiple devices.

Backed by Stratix III family capabilities such as selectable core voltage, rich clocking and PLL resources, and configuration security and reliability features, this FPGA is suited for teams seeking a scalable, long‑lived platform for performance‑oriented system designs.

Request a quote or submit an inquiry to get pricing and availability for EP3SL340F1760C2G and to discuss how it can meet your project requirements.

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