EP3SL340F1760C3N

The EP3SL340F1760C3N is a Stratix III L Field Programmable Gate Array (FPGA) in a 1760-FCBGA (42.5 × 42.5 mm) package designed for complex, high‑density digital designs. The device integrates a large logic fabric, significant embedded memory, extensive I/O, and architecture features called out in the Stratix III device handbook (TriMatrix embedded memory blocks, DSP blocks, MultiTrack interconnect and high‑performance clock networks).

Targeted at commercial applications, the device is supplied for surface‑mount assembly, operates over a 0 °C to 85 °C range, and accepts core supply voltages from 0.86 V to 1.15 V. It is RoHS compliant and intended for designs that require high logic capacity and dense I/O integration.

Key Features

• High logic capacity — Approximately 337,500 logic elements (cells) to support large, complex digital designs.
• Embedded memory — Approximately 18.8 Mbits of on‑chip RAM for buffering, FIFOs and intermediate storage.
• Extensive I/O — Up to 1,120 general I/O pins, enabling broad external device and memory interfacing.
• Package and mounting — 1760‑FBGGA (1760‑FCBGA) surface‑mount package with 42.5 × 42.5 mm dimensions for high‑density board integration.
• Core power range — Core voltage supply range from 0.86 V to 1.15 V to match system power domains.
• Commercial temperature grade — Rated for operation from 0 °C to 85 °C for standard commercial deployments.
• Architecture and system features — Device handbook references include TriMatrix memory blocks, DSP blocks, MultiTrack interconnect, clock networks and PLLs, high‑speed differential I/O with DPA, JTAG boundary‑scan and programmable power/configuration capabilities.
• Compliance — RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• Signal processing and DSP systems — Large logic capacity and embedded memory support complex DSP pipelines and algorithm acceleration.
• Networking and communications — High I/O count and dedicated architecture elements accommodate protocol handling, packet processing and interface bridging.
• Video and imaging — On‑chip memory and DSP resources enable buffering, scaling and real‑time image processing tasks.
• Prototyping and complex digital systems — Dense logic resources and flexible I/O make the device suitable for advanced system prototypes and proof‑of‑concepts requiring substantial programmable logic.

Unique Advantages

• High logic density: Approximately 337,500 logic elements allow large designs to be implemented without external glue logic.
• Substantial embedded memory: Approximately 18.8 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and storage needs.
• Large I/O budget: 1,120 I/O pins provide flexibility for multiple parallel interfaces and external memory connections.
• Robust architecture features: Stratix III family architecture items such as TriMatrix memory blocks, DSP blocks and PLL/clock networks (as referenced in the device handbook) support a range of compute and timing requirements.
• Commercial readiness and compliance: Surface‑mount 1760‑FCBGA packaging, commercial temperature grading (0 °C to 85 °C), and RoHS compliance simplify integration into standard production flows.
• Configurable power and system management: Device handbook references programmable power and configuration capabilities that help align the FPGA to system power architectures.

Why Choose EP3SL340F1760C3N?

The EP3SL340F1760C3N positions itself as a high‑capacity, commercial‑grade FPGA for designs that require dense logic, significant embedded memory and a large number of I/Os. Its Stratix III family architecture elements—documented in the device handbook—provide the building blocks for DSP, memory‑intensive and timing‑sensitive applications while remaining compatible with standard surface‑mount board assembly.

This device is suited for engineering teams and procurement looking to implement complex digital functions within a single, RoHS‑compliant FPGA package, with support for a commercial operating temperature range and a defined core voltage window for system power planning.

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