EP3SL340F1760C2

The EP3SL340F1760C2 is a Stratix® III L Field Programmable Gate Array in a 1760-FCBGA package, offering high-density programmable logic and large on-chip memory for complex digital designs. With 337,500 logic elements, approximately 18 Mbits of embedded RAM, and 1,120 I/O pins, it is tailored for applications that require extensive logic capacity, substantial memory, and dense I/O integration within a surface-mount FCBGA footprint.

Key Features

• Logic Capacity  Provides 337,500 logic elements to implement complex digital functions and large-scale combinational/sequential logic.
• Embedded Memory  Includes approximately 18 Mbits of on-chip RAM for buffering, data storage, and intermediate processing within the FPGA fabric.
• I/O Density  Up to 1,120 general-purpose I/O pins enable high channel counts and wide parallel interfaces for demanding system integration.
• Power Supply Range  Operates from 0.860 V to 1.15 V core supply voltage to match platform power architectures and enable system-level power planning.
• Package and Mounting  Supplied in a 1760-FCBGA (42.5 × 42.5 mm) surface-mount package for compact board integration and high pin count routing.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, suitable for commercial-grade applications and environments.
• RoHS Compliant  Meets RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

• High-density digital systems  Implement complex logic and custom processing functions that require hundreds of thousands of logic elements and significant on-chip RAM.
• Data aggregation and buffering  Use the large embedded memory together with dense I/O to collect, buffer, and route data between subsystems.
• Custom hardware acceleration  Deploy as a programmable accelerator for compute- or logic-intensive tasks where large logic capacity and fast local memory are needed.
• Prototype and platform development  Integrate into development platforms that require a high pin count and scalable logic resources for evaluation and system validation.

Unique Advantages

• High logic integration: 337,500 logic elements enable consolidation of large design functions into a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 18 Mbits of embedded RAM supports buffering, FIFOs, and local data storage without external memory in many use cases.
• Extensive I/O capability: 1,120 I/O pins provide flexibility for wide buses, many peripheral interfaces, or parallel data channels.
• Compact, high-pin-count package: The 1760-FCBGA (42.5 × 42.5 mm) package delivers maximum pin density in a surface-mount form factor for space-constrained designs.
• Commercial temperature rating: 0 °C to 85 °C operation aligns this device with a wide range of commercial electronic products.
• RoHS compliance: Facilitates integration into lead-free manufacturing processes and environmentally conscious designs.

Why Choose EP3SL340F1760C2?

The EP3SL340F1760C2 balances very high logic capacity, substantial on-chip memory, and a large I/O complement in a single surface-mount FCBGA package, making it suitable for designers who need to consolidate complex digital functions while maintaining dense connectivity. Its commercial temperature rating and RoHS compliance support deployment in a variety of non-automotive, commercial electronic systems.

For projects that demand scalable logic resources, significant embedded RAM, and high pin count integration, the EP3SL340F1760C2 offers a robust platform for implementing sophisticated programmable logic solutions.

Request a quote or submit a procurement inquiry today to check availability and obtain pricing information for the EP3SL340F1760C2.