EP3SL50F484C2N

The EP3SL50F484C2N is a Stratix® III L field programmable gate array (FPGA) provided in a 484-ball fine-pitch BGA package. It integrates a large array of programmable logic and embedded memory with a high I/O count for dense, board-level digital designs.

With 47,500 logic elements, approximately 2.18 Mbits of on-chip RAM and 296 I/O pins, this device is suited to applications that require substantial logic capacity, on-chip storage, and broad external interfacing within a commercial-temperature range.

Key Features

• Programmable Logic Capacity — 47,500 logic elements to implement complex digital functions and custom logic blocks.
• Embedded Memory — Approximately 2.18 Mbits of on-chip RAM for buffering, FIFOs, and embedded data structures without external memory in many cases.
• I/O Resources — 296 user I/O pins to support multiple interfaces and high-pin-count connections to peripherals and mezzanine boards.
• Power Supply — Core voltage specified from 860 mV to 1.15 V to align with target system power rails and regulator designs.
• Package and Mounting — 484-ball FBGA (23×23) package, surface-mount, suitable for compact, high-density PCB implementations.
• Commercial Grade and Temperature Range — Rated for commercial operation from 0 °C to 85 °C, suitable for laboratory, consumer, and general industrial environments.
• RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

• High-density digital processing — Implement custom datapaths, protocol engines, and accelerators using the device’s 47,500 logic elements and on-chip RAM for intermediate storage.
• Interface aggregation and bridging — Use the 296 I/O pins to connect and translate between multiple board-level interfaces and peripherals.
• Embedded system prototyping — Develop and validate complex logic and memory architectures on a reprogrammable platform with ample resources for iterative design.

Unique Advantages

• Substantial logic resources: 47,500 logic elements enable implementation of sizable custom logic functions without immediate partitioning across multiple devices.
• Integrated on-chip RAM: Approximately 2.18 Mbits of embedded memory reduces reliance on external RAM for many buffering and storage needs, simplifying BOM and board routing.
• High I/O count: 296 I/O pins support complex connectivity and signal routing for multi-interface designs.
• Compact package: 484-ball FBGA (23×23) delivers high pin density in a surface-mount form factor for space-constrained PCBs.
• Commercial temperature rating: Operates across 0 °C to 85 °C for standard commercial deployments and lab environments.
• RoHS compliant: Facilitates lead-free assembly and easier compliance with environmental manufacturing requirements.

Why Choose EP3SL50F484C2N?

The EP3SL50F484C2N combines a large programmable logic array, meaningful on-chip memory, and a high I/O count in a compact FBGA package, offering a balanced platform for designers implementing complex, board-level digital systems. Its commercial temperature rating and RoHS compliance make it suitable for a range of general-purpose and product development applications.

This device is well suited to engineering teams and procurement organizations looking for a reprogrammable, high-density logic solution that supports substantial embedded memory and I/O integration while maintaining standard commercial operating conditions.

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