EP3SL340F1517C4

The EP3SL340F1517C4 is a Stratix® III L family FPGA delivering high on-chip resources for dense logic and memory integration. It features a large logic fabric and substantial embedded RAM, packaged in a 1517-ball FCBGA for surface-mount PCB applications.

Designed for commercial-grade applications, this device is suited to designs that require a high count of I/O and embedded memory, with a core voltage operating window of 0.86–1.15 V and an ambient temperature rating of 0 °C to 85 °C.

Key Features

• Logic Capacity  Provides 337,500 logic elements to implement complex digital designs and large-scale RTL integration.
• Logic Blocks  Includes 13,500 logic array blocks to structure and partition designs for performance and modularity.
• Embedded Memory  Approximately 18.82 Mbits of on-chip RAM to support buffering, FIFOs, and data-intensive processing without external memory for many functions.
• I/O Resources  976 available I/O pins to support wide parallel interfaces, multiple peripherals, and board-level connectivity options.
• Power and Core Voltage  Core supply range of 0.86–1.15 V to match system power rails and enable controlled power budgeting.
• Package and Mounting  1517-BBGA FCBGA package (supplier device package: 1517-FBGA, 40×40) in a surface-mount form factor for compact, high-density PCB layouts.
• Commercial Grade and Temperature  Specified for commercial operation with an ambient range of 0 °C to 85 °C.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• Data and Packet Processing  Use the large logic and memory resources to implement packet parsing, lookup tables, and custom network processing functions.
• Signal Processing  Deploy for FPGA-based DSP pipelines, buffering, and real-time data paths that leverage the device’s embedded RAM and extensive logic.
• High-Density I/O Systems  Ideal for systems requiring broad parallel connectivity, interface bridging, or multi-channel sensor aggregation using its 976 I/O pins.
• Custom Hardware Acceleration  Implement application-specific accelerators and offload compute-intensive tasks into dedicated, high-capacity logic blocks.

Unique Advantages

• Large on-chip resource pool: 337,500 logic elements and approximately 18.82 Mbits of embedded memory reduce reliance on external components and simplify board-level memory architecture.
• Extensive I/O capability: 976 I/O pins enable flexible partitioning of interfaces and accommodate multi-channel systems without complex multiplexing.
• Compact system footprint: FCBGA 1517 package in a 40×40 footprint supports high-density PCB designs while maintaining surface-mount assembly workflows.
• Power-flexible core: Core supply range of 0.86–1.15 V provides design flexibility for power sequencing and system-level power optimization.
• Commercial-ready operation: Specified 0 °C to 85 °C operating range for mainstream commercial applications where standard ambient operation is required.
• RoHS compliance: Conforms to RoHS for regulatory and environmental considerations in production designs.

Why Choose EP3SL340F1517C4?

The EP3SL340F1517C4 positions itself as a high-capacity Stratix® III L FPGA targeted at commercial applications that demand substantial logic, memory, and I/O integration in a compact package. Its combination of 337,500 logic elements, approximately 18.82 Mbits of embedded RAM, and 976 I/O pins makes it suitable for complex data, signal-processing, and interface-heavy designs.

For engineering teams developing high-density FPGA solutions, this device offers a balance of on-chip resources and package density that supports scalable designs and reduces external BOM complexity while maintaining standard commercial temperature and power requirements.

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