EP3SL200H780I4N

The EP3SL200H780I4N is a Stratix® III L field‑programmable gate array (FPGA) from Intel designed for industrial applications. It delivers a large programmable fabric with 200,000 logic elements and extensive on‑chip memory to implement complex custom logic, buffering and data processing functions.

With 488 user I/Os, a wide core voltage range and an industrial operating temperature span, this device is suited to designs that require high integration density, significant embedded memory and robust thermal performance in surface‑mount FCBGA packaging.

Key Features

• Core Logic 200,000 logic elements and approximately 8,000 logic blocks provide the capacity to implement large, custom digital designs.
• Embedded Memory Approximately 10.9 Mbits of on‑chip RAM supports buffering, packet queuing and local data storage for high‑throughput logic.
• I/O Density 488 user I/Os enable broad peripheral interfacing and multi‑lane signal routing within a single device.
• Power Supply Range Core voltage supply range of 860 mV to 1.15 V for compatibility with various system power rails and power‑management schemes.
• Package & Mounting 780‑BBGA (FCBGA) package, supplier package 780‑HBGA (33×33), designed for surface‑mount assembly to support compact board layouts.
• Industrial Temperature Grade Rated for −40 °C to 100 °C operation to meet industrial environmental requirements.
• Regulatory RoHS compliant.

Typical Applications

• Industrial Control Implement custom control logic, real‑time processing and I/O aggregation within industrial automation systems using the device’s logic density and wide temperature rating.
• Data Buffering & Processing Use the approximately 10.9 Mbits of embedded RAM for packet buffering, temporary storage and streaming data manipulation.
• High‑I/O Systems Deploy in systems requiring dense parallel interfacing or multi‑channel I/O thanks to 488 user I/Os.

Unique Advantages

• High Logic Capacity: 200,000 logic elements enable complex, large‑scale custom logic implementations without partitioning across multiple devices.
• Significant Embedded Memory: Approximately 10.9 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and storage tasks.
• Robust Industrial Operation: −40 °C to 100 °C rating supports deployment in industrial environments with wide temperature swings.
• Broad I/O Count: 488 user I/Os provide flexibility for multi‑channel interfaces and high‑density connectivity on a single FPGA.
• Compact FCBGA Package: 780‑BBGA (780‑HBGA supplier package) enables high integration density for space‑constrained board designs.
• RoHS Compliance: Conforms to RoHS requirements for environmental and regulatory compatibility.

Why Choose EP3SL200H780I4N?

The EP3SL200H780I4N positions itself as a high‑capacity, industrial‑grade FPGA that combines large logic resources, substantial embedded memory and a high I/O count in a compact FCBGA package. It supports designs that need on‑device memory and extensive programmable logic while operating across a broad industrial temperature range.

This device is appropriate for engineering teams building industrial control systems, high‑I/O data processing boards or other embedded applications where integration density, thermal robustness and on‑chip resources translate into a simpler BOM and fewer external components.

Request a quote or submit your requirements to receive pricing and availability for the EP3SL200H780I4N.