EP3SL200H780I4L

The EP3SL200H780I4L is a Stratix® III L field programmable gate array (FPGA) IC from Intel, packaged in a 780-BBGA (FCBGA) package. It combines high logic capacity, substantial embedded RAM, and a large I/O count for demanding industrial applications.

With 200,000 logic elements, approximately 10.9 Mbits of on-chip RAM, and 488 I/O pins, this device is aimed at designs that require dense logic integration, abundant local memory, and extensive interface connectivity while operating across an industrial temperature range.

Key Features

• Logic Capacity 200,000 logic elements provide substantial on-chip programmable fabric for implementing complex digital logic and custom architectures.
• Embedded Memory Approximately 10.9 Mbits of total RAM bits available for buffering, state storage, and on-chip data processing.
• I/O Density 488 general-purpose I/O pins support high connectivity for multiple external interfaces and parallel data paths.
• Package and Mounting 780-BBGA, FCBGA package (supplier device package 780-HBGA, 33×33) designed for surface-mount assembly to support compact board layouts.
• Power Supply Range Core voltage range from 0.860 V to 1.15 V to match target power domains and system power architectures.
• Industrial Temperature Grade Qualified for operation from −40 °C to 100 °C, suitable for industrial environments and extended-temperature systems.
• Compliance RoHS compliant to support environmental and regulatory requirements.

Typical Applications

• Industrial Control and Automation — Suited for controllers and automation systems that require robust operation across −40 °C to 100 °C and high logic integration.
• I/O-Intensive Embedded Systems — High pin count supports multiple sensors, actuators, and peripheral interfaces in embedded designs.
• Custom Digital Processing — Large logic and on-chip memory capacity enable implementation of custom accelerators, signal processing blocks, and glue logic.

Unique Advantages

• High Logic Density: 200,000 logic elements enable consolidation of complex functions into a single programmable device, reducing board-level component count.
• Substantial On-Chip Memory: Approximately 10.9 Mbits of embedded RAM supports local buffering and stateful processing without immediate dependence on external memory.
• Extensive Connectivity: 488 I/O pins provide flexibility to interface with multiple subsystems and parallel data channels.
• Industrial Temperature Operation: −40 °C to 100 °C rating supports deployment in harsh or temperature-variable industrial environments.
• Compact BGA Packaging: 780-BBGA (33×33) package enables high-density PCB integration while maintaining robust mechanical mounting.
• Vendor Backing: Manufactured by Intel, offering continuity of supply and access to vendor resources and documentation.

Why Choose EP3SL200H780I4L?

The EP3SL200H780I4L positions itself as a high-capacity, industrial-grade FPGA solution for designs that demand large programmable logic resources, significant on-chip memory, and extensive I/O in a compact BGA package. Its voltage and temperature specifications make it suitable for systems that require stable operation across varying conditions.

This device is a fit for engineering teams building dense, interface-rich embedded systems and industrial control equipment that benefit from the integration and configurability of an FPGA backed by Intel's platform and documentation.

If you need pricing, availability, or a formal quote for the EP3SL200H780I4L, request a quote or submit your requirements to initiate a sales inquiry.