EP3SL200H780I4LG

The EP3SL200H780I4LG is an Intel Stratix III family FPGA offered in a 780-ball FCBGA package. It is built on a 1.1‑V, 65‑nm all‑layer copper SRAM process and is intended for high‑performance logic, digital signal processing (DSP), and embedded system designs.

With 200,000 logic elements, approximately 10.9 Mbits of embedded RAM, and 488 user I/Os in a surface‑mount, industrial‑grade package, this device targets applications that require dense logic, significant on‑chip memory, and robust I/O in a rugged operating range (-40 °C to 100 °C).

Key Features

• Logic Capacity: 200,000 logic elements providing high-density programmable logic for complex designs.
• Embedded Memory: Approximately 10.9 Mbits of on‑chip RAM to support large buffers, FIFOs and on‑chip data storage.
• I/O and Packaging: 488 user I/Os in a 780‑ball FCBGA (780‑HBGA, 33×33) surface‑mount package for wide signal routing and high‑pin‑count designs.
• Power and Core Voltage: Operates with a core supply range of 860 mV to 1.15 V and incorporates the family’s Programmable Power Technology and selectable core voltage options for balancing performance and power.
• Temperature and Grade: Industrial grade with an operating temperature range of −40 °C to 100 °C suitable for demanding environments.
• High‑Speed DSP and Clocking (family features): Stratix III family devices include high‑speed DSP blocks for dedicated multipliers and MAC functions and a rich clocking architecture with multiple global, regional, and peripheral clocks plus PLLs for complex timing topologies.
• System Reliability and Security (family features): Family features include optional 256‑bit AES encryption for configuration security, CRC for configuration memory error detection, and ECC for embedded memory error correction.
• Standards and Interfaces (family features): Stratix III family supports a broad range of high‑speed memory interfaces and differential I/O technologies to enable high‑bandwidth external memory and communication links.
• Compliance: RoHS compliant.

Typical Applications

• High‑Performance DSP and Signal Processing: Implement filters, FFTs and multiply‑accumulate engines using the device’s embedded memory and DSP resources.
• Networking and Communications: Use high pin count I/O and family support for high‑speed interfaces to implement networking, protocol bridging, and packet processing functions.
• High‑Bandwidth Memory Interfaces: Leverage on‑chip memory and I/O capabilities to connect to DDR, DDR2/DDR3 and other external memories for memory‑centric applications.
• Embedded Systems and Accelerators: Deploy as a custom logic accelerator or system controller where significant logic density and on‑chip RAM reduce external component count.

Unique Advantages

• High integration density: 200,000 logic elements and ~10.9 Mbits of embedded RAM consolidate logic and memory on a single device, reducing board complexity.
• Flexible power/performance tradeoffs: Selectable core voltage and Programmable Power Technology let designers optimize for performance or lower power within the specified 0.86–1.15 V core range.
• Robust I/O and packaging: 488 user I/Os in a 780‑ball FCBGA (33×33) package provide the pin count and package density needed for complex, high‑I/O systems.
• Industrial operating range: Rated from −40 °C to 100 °C for deployment in temperature‑demanding environments.
• Built‑in reliability and security features: Family‑level CRC, ECC and optional AES configuration encryption help protect configuration integrity and on‑chip data.
• RoHS compliant: Meets environmental compliance expectations for modern electronic assemblies.

Why Choose EP3SL200H780I4LG?

The EP3SL200H780I4LG combines high logic capacity, substantial on‑chip memory and extensive I/O in an industrial‑grade Stratix III device. It is well suited for designs that demand dense programmable logic, significant embedded RAM, and flexible power/performance tuning.

Engineers building DSP engines, high‑bandwidth interfaces, network processors, or custom accelerators will find a balance of performance, integration and system reliability backed by the Stratix III family feature set.

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