EP3SL200H780I4

The EP3SL200H780I4 is a Stratix® III L FPGA from Intel designed for industrial-grade, high-density logic integration. It provides 200,000 logic elements, approximately 10.9 Mbits of embedded memory, and 488 user I/Os in a 780-ball BGA (FCBGA) package.

With a supply voltage range of 0.86 V to 1.15 V and an operating temperature range of –40 °C to 100 °C, this surface-mount device is suited for demanding embedded and system-level designs that require significant on-chip logic and memory resources while meeting industrial thermal requirements.

Key Features

• Core Logic Provides 200,000 logic elements to support complex programmable logic, custom datapaths, and system integration tasks.
• Embedded Memory Approximately 10.9 Mbits of on-chip RAM for buffering, state storage, and intermediate data processing.
• I/O Count 488 user I/O pins to enable high-channel connectivity to peripherals, interfaces, and external devices.
• Power Flexible core supply operating range from 0.86 V to 1.15 V to support system power architectures and optimized power sequencing.
• Package & Mounting 780-ball BGA (FCBGA) with supplier device package 780-HBGA (33×33) for dense board-level integration; surface-mount mounting type.
• Temperature & Reliability Industrial-grade device rated for operation from –40 °C to 100 °C, suitable for extended temperature environments.
• Compliance RoHS-compliant to meet environmental and regulatory requirements.

Typical Applications

• High-density signal processing — Suitable where substantial logic and embedded memory are required for real-time processing and data buffering.
• Multi-channel I/O systems — 488 I/Os support complex interface routing for sensor arrays, communication front-ends, and large peripheral sets.
• System integration and prototyping — Large logic capacity and on-chip RAM enable consolidation of functions and rapid hardware development.

Unique Advantages

• High logic capacity: 200,000 logic elements allow implementation of complex custom logic and parallel processing architectures without external gate arrays.
• Significant on-chip memory: Approximately 10.9 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs, simplifying BOM and board routing.
• Extensive I/O resources: 488 I/Os provide flexibility for interfacing multiple peripherals and high-channel systems without additional multiplexing hardware.
• Industrial temperature rating: –40 °C to 100 °C operation supports deployment in thermally demanding environments.
• Compact, high-density package: 780-ball BGA (33×33) enables dense, surface-mount implementation for space-constrained system boards.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and supply chain requirements.

Why Choose EP3SL200H780I4?

The EP3SL200H780I4 positions itself as a high-density, industrial-grade FPGA option for designs that need substantial programmable logic, abundant embedded memory, and a large I/O complement in a compact BGA package. Its combination of 200,000 logic elements and approximately 10.9 Mbits of on-chip RAM makes it appropriate for system consolidation, complex data paths, and multi-channel interface applications.

Engineers and procurement teams seeking a RoHS-compliant, surface-mount FPGA with a broad operating temperature range and flexible core supply can leverage this device to reduce external components, simplify board design, and deliver robust performance in industrial environments.

Request a quote or submit your specifications to receive pricing and availability for the EP3SL200H780I4. Our team can assist with lead times and volume options to support your project schedule.