EP3SL200H780C4N

The EP3SL200H780C4N is a Stratix® III L field programmable gate array providing a large fabric of programmable logic and on-chip memory. The device offers up to 200,000 logic elements, approximately 10.9 Mbits of embedded memory, and 488 I/O pins in a 780-ball FCBGA package for surface-mount applications.

With a nominal supply range from 860 mV to 1.15 V and a commercial operating temperature range of 0 °C to 85 °C, this FPGA targets designs that require substantial logic capacity, significant on-chip RAM, and a high I/O count within a compact BGA form factor.

Key Features

• Programmable Logic Up to 200,000 logic elements to implement complex digital functions and custom logic architectures.
• Logic Array Blocks Architected with the device fabric to support extensive logic partitioning and design scalability.
• Embedded Memory Approximately 10.9 Mbits of on-chip RAM for buffering, FIFOs, and state storage without external memory.
• I/O Capacity 488 I/O pins to support broad interfacing requirements and dense system connectivity.
• Power Supply Operates from 860 mV to 1.15 V supply rails to match target system power architectures.
• Package & Mounting 780-ball FCBGA (33 × 33 mm HBGA supplier package) for surface-mount assembly and compact board footprints.
• Operating Range Commercial grade performance with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS-compliant construction to meet common lead-free assembly requirements.

Typical Applications

• High-density digital processing — Implements large-scale logic designs using the device’s 200,000 logic elements and extensive on-chip memory.
• Multi-I/O system interfaces — Leverages 488 I/Os for boards that require numerous external connections and peripheral integration.
• Embedded memory buffering — Uses approximately 10.9 Mbits of embedded RAM for frame buffering, FIFO staging, and intermediate data storage.

Unique Advantages

• Substantial logic capacity: 200,000 logic elements enable implementation of complex state machines, datapaths, and custom accelerators on a single device.
• Significant on-chip memory: Approximately 10.9 Mbits of RAM reduces reliance on external memory, simplifying BOM and board routing.
• High I/O density: 488 available I/Os allow dense peripheral and bus interfacing without external multiplexing.
• Compact BGA package: 780-ball FCBGA (33 × 33 mm) provides a high-pin-count solution in a space-efficient form factor for surface-mount assembly.
• RoHS-compliant: Meets lead-free assembly requirements for modern production processes.

Why Choose EP3SL200H780C4N?

The EP3SL200H780C4N positions itself as a high-capacity Stratix® III L FPGA option for designs that require large programmable logic resources, substantial on-chip memory, and a high number of I/Os in a compact BGA package. Its supply voltage and commercial temperature rating align it with many standard embedded and board-level applications.

Choose this device when your design demands consolidated logic and memory on a single FPGA, enabling reduced external components and streamlined board layouts while maintaining RoHS compliance and a surface-mount package suitable for modern assembly flows.

Request a quote or submit an inquiry to get pricing and availability for the EP3SL200H780C4N and integrate its logic and memory capacity into your next design.