EP3SL200F1517C4LN

The EP3SL200F1517C4LN is a Stratix® III L Field Programmable Gate Array (FPGA) packaged in a 1517-BBGA FCBGA. It delivers a large programmable fabric with substantial embedded memory and a high count of I/O, suitable for board-level designs that require integrated logic density and extensive interfacing.

Designed for surface-mount applications, the device operates across a nominal core supply range and within a commercial temperature window, providing a compact, RoHS-compliant FPGA option for complex logic and memory-centric implementations.

Key Features

• Core Logic Capacity — 200,000 logic elements (cells) for implementing complex digital logic and large-scale programmable designs.
• Embedded Memory — Total on-chip RAM of 10,901,504 bits (approximately 10.9 Mbits) to support buffer, cache, and state storage needs without immediate external memory.
• High I/O Count — 976 available I/O connections to support broad interfacing and multi-channel signal integration on a single device.
• Power Range — Core voltage supply range of 0.86 V to 1.15 V to match system-level power architectures and enable optimized power planning.
• Package & Mounting — 1517-BBGA FCBGA, supplier device package 1517-FBGA (40×40), designed for surface-mount assembly to support compact PCB layouts.
• Operating Range — Commercial grade operation from 0 °C to 85 °C for typical embedded and electronics applications.
• Regulatory — RoHS compliant for reduced hazardous substance content in manufacturing.

Typical Applications

• High-density logic systems — Implement complex state machines and control logic using the device’s 200,000 logic elements to consolidate multiple functions on a single FPGA.
• Memory-centric designs — Leverage approximately 10.9 Mbits of embedded memory for buffering, packet storage, or local data caches to reduce external memory dependencies.
• Multi-channel I/O aggregation — Use the 976 I/O connections to interface with numerous sensors, transceivers, or peripheral buses in systems that require broad connectivity.

Unique Advantages

• High logic density: 200,000 logic elements enable implementation of large, integrated digital functions without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 10.9 Mbits of embedded RAM reduces the need for immediate external memory, simplifying BOM and board routing.
• Extensive interfacing: 976 I/O connections support complex multi-device or multi-protocol designs on a single FPGA platform.
• Compact surface-mount package: 1517-BBGA (1517-FBGA, 40×40) facilitates space-efficient PCB integration while maintaining high pin counts.
• Low-voltage core operation: 0.86–1.15 V supply range allows alignment with modern low-voltage power domains for optimized power design.
• RoHS compliant: Meets lead-free and hazardous substance requirements for environmentally conscious manufacturing.

Why Choose EP3SL200F1517C4LN?

The EP3SL200F1517C4LN positions itself as a compact, high-capacity FPGA option for designs that require large programmable logic resources, significant embedded memory, and dense I/O connectivity in a surface-mount FCBGA package. Its combination of 200,000 logic elements, approximately 10.9 Mbits of on-chip RAM, and 976 I/O makes it suitable for consolidating functions and simplifying board-level architecture.

For engineers and procurement teams targeting commercial-temperature applications where on-chip resources and high I/O density reduce system complexity and external components, this Stratix® III L FPGA offers a verifiable balance of integration and form-factor efficiency.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the EP3SL200F1517C4LN.