EP3SL200F1517C4G

The EP3SL200F1517C4G is a high-density Stratix III family FPGA optimized for performance and integration. It delivers approximately 200,000 logic elements, roughly 10.9 Mbits of embedded memory, and up to 976 user I/O pins in a 1517-FBGA (40×40) surface-mount package.

Designed for compute- and I/O-intensive applications, this commercial-grade FPGA supports selectable core-voltage operation and programmable power features from the Stratix III architecture, enabling designers to balance performance and power across demanding systems.

Key Features

• Core Logic  Approximately 200,000 logic elements to implement complex custom logic, control functions, and protocol processing.
• Embedded Memory  Approximately 10.9 Mbits of on-chip RAM for buffers, FIFOs, and packet or frame storage.
• I/O Density  Up to 976 user I/O pins arranged for modular I/O bank organization to support wide external interfacing.
• Programmable Power & Core Voltage  Supports selectable core voltage and programmable power technology to help optimize power versus performance across the design.
• Clocking and PLLs  Family-level support includes numerous global, regional, and peripheral clocks and multiple PLLs for flexible clock synthesis and timing architectures.
• High-Speed I/O & SERDES  Stratix III family features high-speed differential I/O and SERDES with dynamic phase alignment for high-bandwidth serial links.
• DSP and Arithmetic  Family includes dedicated DSP resources and multiplier support for signal processing and compute-intensive datapaths.
• Security & Reliability  Family-level options include 256-bit AES configuration-bitstream security and on-chip error detection/ECC mechanisms for configuration and memory protection.
• Package & Mounting  1517-FBGA (1517-BBGA) surface-mount package (40×40) suitable for compact board-level integration; RoHS compliant.
• Operating Range  Commercial operating temperature range of 0 °C to 85 °C and a core supply range of 0.86 V to 1.15 V.

Typical Applications

• High‑Performance Signal Processing  Implement DSP pipelines, FIR filters, and custom accelerators using dense logic and dedicated multiplier resources.
• Networking & Communications  High I/O count and SERDES-enabled differential interfaces make the device suitable for packet processing, protocol bridging, and high‑speed link implementations.
• Memory Interface Controllers  Use embedded memory and modular I/O banks to build DDR/DDR2/DDR3 and other external memory controllers and buffering solutions.
• Embedded System Prototyping  Large logic capacity and on-chip resources support SoC prototyping, custom peripherals, and integration of soft processors.

Unique Advantages

• High Logic Density:  Approximately 200,000 logic elements provide headroom for complex logic, state machines, and datapaths without external glue logic.
• Substantial On‑Chip Memory:  Around 10.9 Mbits of embedded RAM reduces external memory dependency for buffering and packet storage.
• Extensive I/O:  Up to 976 I/Os and modular bank architecture simplify integration with high-pin-count peripherals and external devices.
• Power Versatility:  Selectable core-voltage and programmable power features allow designers to tune power consumption to match workload and thermal budgets.
• Robust Clocking & Timing:  Multiple global and regional clocks plus PLL flexibility support complex timing domains and dynamic clocking strategies.
• Security & Reliability Features:  Family-level AES configuration security and memory error detection/ECC capabilities support secure and resilient system designs.

Why Choose EP3SL200F1517C4G?

The EP3SL200F1517C4G positions itself as a high-capacity Stratix III FPGA for designs that require dense logic, substantial embedded memory, and extensive I/O in a compact FBGA package. Its selectable core voltage and family-level programmable power features help teams optimize the trade-off between performance and power consumption.

This device is well suited to engineering teams developing high-throughput signal-processing, networking, memory-interface, or embedded-prototyping solutions that need scalable logic resources, reliable on-chip memory, and flexible clocking and I/O options backed by Stratix III architectural capabilities.

Request a quote or submit a purchase inquiry to learn more about availability, lead times, and volume pricing for EP3SL200F1517C4G.