EP3SL200F1517C3

The EP3SL200F1517C3 is a Stratix® III L Field Programmable Gate Array (FPGA) IC designed for high-density digital logic implementations. It provides a large logic capacity, substantial on-chip memory, and a very high I/O count in a compact FCBGA package, addressing designs that require extensive logic resources and wide parallel connectivity.

With a core supply range of 0.86 V to 1.15 V and a commercial operating temperature range from 0 °C to 85 °C, this surface-mount FPGA is suited for commercial electronic systems that demand integration of complex logic and memory functions in a single device.

Key Features

• Logic Capacity  200,000 logic elements organized for high-density designs, enabling complex combinational and sequential logic implementations.
• Logic Blocks  Approximately 8,000 logic blocks to structure and partition design resources efficiently.
• Embedded Memory  Approximately 10.9 Mbits of on-chip RAM to support large buffers, state storage, and data processing tasks without external memory.
• High I/O Count  976 I/O pins to accommodate extensive peripheral interfacing, parallel buses, or multi-channel I/O requirements.
• Power and Core Voltage  Core supply voltage range from 0.86 V to 1.15 V to match platform power architectures.
• Package and Mounting  1517-BBGA FCBGA package (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for compact board integration.
• Temperature and Grade  Commercial grade operation from 0 °C to 85 °C for standard commercial product environments.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density digital processing  Used where large programmable logic capacity and on-chip RAM are required to implement complex algorithms and data paths.
• Multi-channel I/O systems  Suitable for applications that need many parallel interfaces or broad connectivity thanks to its 976 I/O pins.
• Prototyping and system integration  Employed in development platforms and integrated systems that benefit from consolidating logic and memory into a single FPGA package.

Unique Advantages

• High integration density: 200,000 logic elements reduce the need for multiple discrete logic devices, simplifying board design.
• Substantial on-chip memory: Approximately 10.9 Mbits of embedded RAM supports larger data buffers and internal storage without adding external memory components.
• Extensive I/O capability: 976 I/O pins allow direct connection to numerous peripherals, sensors, or parallel interfaces, minimizing external multiplexing.
• Compact surface-mount FCBGA: The 1517-FBGA (40×40) package provides a space-efficient solution for dense PCB layouts.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match standard commercial application environments.
• RoHS compliant: Meets environmental compliance expectations for modern manufacturing processes.

Why Choose EP3SL200F1517C3?

The EP3SL200F1517C3 combines a very large logic element count, significant embedded memory, and nearly one thousand I/O pins in a compact FCBGA package, positioning it for commercial designs that require consolidation of complex digital functions. Its supply voltage range and commercial temperature rating suit a wide range of standard electronic systems.

This device is ideal for engineers and procurement teams targeting high-density programmable logic, substantial on-chip RAM, and extensive I/O capability within a single, RoHS-compliant FPGA package. It delivers scalability and integration that can simplify board-level designs and reduce component count.

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