EP3SL200F1517C4LG

The EP3SL200F1517C4LG is a high-density Field Programmable Gate Array from Intel, implemented on the Stratix III device family architecture. It delivers a combination of large logic capacity, substantial embedded memory, and an extensive I/O complement suitable for demanding logic, DSP and embedded system designs.

Designed for commercial-grade applications, this surface-mount FCBGA device offers selectable core voltage operation and architecture-level power management to balance performance and efficiency in complex multi-function systems.

Key Features

• Core and Logic Approximately 200,000 logic elements provide the programmable fabric for high-density logic and system integration.
• Embedded Memory Approximately 10.9 Mbits of on-chip RAM (10,901,504 total RAM bits) for large buffers, FIFOs and packet/stream processing tasks.
• DSP and Arithmetic Blocks Family-level high-speed DSP blocks support a range of multiplier sizes and multiply-accumulate implementations suitable for signal processing workloads.
• I/O Capacity 976 user I/O pins in a modular I/O bank structure to support wide parallel interfaces and multiple external memory or peripheral connections.
• Clocking and PLLs Multiple on-chip clock resources and PLLs provide flexible clock management for complex timing domains and high-performance designs.
• Power and Core Voltage Selectable core voltage operation with a supply range of 0.86 V to 1.15 V and architecture-level programmable power technology to manage performance versus power.
• Security and Reliability Family-level features include support for 256-bit AES configuration encryption and built-in CRC/ECC mechanisms for configuration and memory integrity.
• Package and Mounting Available in a 1517-FBGA (1517-BBGA, FCBGA) package (40 × 40 mm) for surface-mount board implementation; RoHS compliant.
• Commercial Temperature Rating Specified for operation from 0 °C to 85 °C to meet commercial application requirements.

Typical Applications

• High-Performance Logic and Compute Implement complex control, glue-logic, and acceleration functions where a large count of logic elements and on-chip RAM are required.
• Digital Signal Processing (DSP) Use the device’s DSP-capable fabric and embedded memory for filtering, transforms, and real-time signal processing pipelines.
• Memory Interface and Buffering Leverage the substantial on-chip RAM and abundant I/O for external memory interfacing, buffering and high-throughput data paths.
• Networking and Communications Deploy in systems requiring flexible I/O and clocking to implement protocol bridges, data-path processing, or interface adaptation.

Unique Advantages

• High logic density: Approximately 200,000 logic elements enable consolidation of multiple system functions into a single device, reducing board complexity.
• Large embedded memory: Approximately 10.9 Mbits of on-chip RAM supports sizable FIFOs, packet buffers and state storage without immediate need for external memory.
• Extensive I/O resources: 976 user I/O pins in a modular bank layout give designers the flexibility to connect wide buses and multiple peripherals.
• Configurable power/performance: Selectable core voltage (0.86 V–1.15 V) and programmable power management enable tuning for either higher performance or reduced power consumption.
• Built-in security and integrity: Support for 256-bit AES configuration encryption plus CRC and ECC mechanisms helps protect configuration and on-chip memory integrity.
• Commercial-grade, surface-mount form factor: 1517-FBGA package provides a compact, solderable footprint for production PCBs while meeting commercial operating temperature requirements.

Why Choose EP3SL200F1517C4LG?

The EP3SL200F1517C4LG combines high logic capacity, substantial embedded memory and a broad I/O complement within the Stratix III family architecture to address complex logic, DSP and embedded applications. Its selectable core voltage and family-level programmable power features allow engineers to tune the device for target performance or power budgets.

This part is suited to design teams needing a scalable, commercially-rated FPGA with strong on-chip memory and connectivity for data-path intensive development. The integrated security and integrity features add design robustness for long-term deployments backed by the Stratix III device family documentation and tooling.

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