EP3SL200F1152I4L

The EP3SL200F1152I4L is a Stratix® III L Field Programmable Gate Array (FPGA) from Intel, supplied in a 1152-BBGA (FCBGA) package. It combines a high logic capacity with substantial on-chip memory and a large I/O complement, targeting complex, board-level digital designs in industrial environments.

Key elements include 200,000 logic elements, approximately 10.9 Mbits of embedded RAM, 744 general-purpose I/Os, and an industrial operating temperature range of −40°C to 100°C. The device uses a low-voltage core supply between 860 mV and 1.15 V and is offered in a 1152-FBGA (35×35) surface-mount package.

Key Features

• Core Logic 200,000 logic elements to implement large-scale digital designs and consolidate multiple functions into a single FPGA.
• Embedded Memory Approximately 10.9 Mbits of on-chip RAM for buffering, frame storage, and local data processing without immediate reliance on external memory.
• I/O Density 744 user I/Os to support dense interface requirements and multiple high-pin-count peripherals.
• Power and Voltage Core voltage supply range from 860 mV to 1.15 V to match modern low-voltage power architectures.
• Package and Mounting 1152-BBGA (FCBGA) package, supplier package listed as 1152-FBGA (35×35), surface-mount for compact board-level integration.
• Temperature and Grade Industrial grade device rated for operation from −40°C to 100°C for deployment in harsh or temperature-variable environments.

Typical Applications

• High-density signal processing Implement complex processing pipelines and data-path logic using the device’s large logic and embedded memory resources.
• Communications and networking equipment Leverage the high I/O count and on-chip RAM for packet processing, protocol bridging, and interface aggregation.
• Industrial control and automation Suitable for control logic, sensor aggregation, and deterministic I/O tasks across an industrial temperature range.
• System integration and prototyping Combine multiple system functions into a single FPGA package to reduce board area and simplify system architecture during development.

Unique Advantages

• High logic capacity: 200,000 logic elements enable implementation of large, function-rich designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 10.9 Mbits of embedded RAM reduces dependence on external memory for buffering and local data handling.
• Extensive I/O resources: 744 I/Os provide flexibility for dense peripheral interfacing and multiple parallel data channels.
• Industrial temperature support: Rated for −40°C to 100°C, making it suitable for deployment in temperature-challenging industrial environments.
• Compact BGA footprint: The 1152-FBGA (35×35) surface-mount package supports high-density board designs while maintaining a manageable PCB footprint.
• Low-voltage core operation: 0.86–1.15 V supply range aligns with modern power delivery schemes and can assist overall system power optimization.

Why Choose EP3SL200F1152I4L?

The EP3SL200F1152I4L delivers a combination of large logic resources, significant embedded memory, and a high I/O count in a compact BGA package suited to industrial temperature ranges. Its specification makes it appropriate for designers who need to consolidate complex digital functionality, support dense interfacing, and operate reliably across a wide temperature span.

As a member of the Stratix® III L family from Intel, this device offers a scalable option for system architects and embedded designers focused on integration density, predictable power requirements, and robust board-level implementation.

Request a quote or submit an RFQ to check current availability and pricing for the EP3SL200F1152I4L.