EP3SL200F1152I3N

The EP3SL200F1152I3N is a Stratix® III L Field Programmable Gate Array (FPGA) from Intel, supplied in a 1152‑BBGA FCBGA package. It delivers high logic capacity and a large on‑chip memory footprint in a surface‑mount form factor targeted at industrial applications.

With 200,000 logic elements, approximately 10.9 Mbits of embedded memory and 744 I/Os, this device is intended for designs that require dense logic integration, substantial local memory, and extensive external interfacing while operating across a wide industrial temperature range.

Key Features

• Logic Capacity — 200,000 logic elements to implement complex digital functions and high-density logic architectures.
• Embedded Memory — Approximately 10.9 Mbits of on‑chip RAM to support buffering, packet storage, and local data processing needs.
• I/O Density — 744 user I/O pins to enable broad connectivity to peripherals, sensors, and external interfaces.
• Package and Mounting — 1152‑BBGA (FCBGA) supplier device package (1152‑FBGA, 35×35) with surface‑mount mounting for compact PCB integration.
• Power Supply — Core voltage range of 0.86 V to 1.15 V to match system power-rail architectures.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant — Meets RoHS requirements for lead‑free manufacturing.
• Manufacturer — Intel Stratix® III L family device.

Typical Applications

• Industrial Control and Automation — Use where high logic capacity and numerous I/Os are needed to implement control logic, interface to sensors/actuators, and perform real‑time processing within industrial environments.
• Communications and Networking Equipment — Suitable for designs that require substantial on‑chip memory and logic to handle packet processing and protocol implementation with many external interfaces.
• High‑Density Embedded Systems — Fits compact, surface‑mount system designs that demand integrated logic, memory, and extensive I/O in a single FPGA package.

Unique Advantages

• High logic integration: 200,000 logic elements reduce the need for multiple discrete devices, simplifying system architecture and lowering BOM complexity.
• Large on‑chip memory: Approximately 10.9 Mbits of embedded RAM supports local buffering and data‑intensive processing without immediate dependence on external memory.
• Extensive I/O count: 744 I/Os enable direct interfacing to a wide range of peripherals and external devices, minimizing external multiplexing or bridges.
• Industrial thermal range: −40 °C to 100 °C rating allows deployment in demanding environmental conditions common to industrial systems.
• Compact FCBGA package: 1152‑BBGA footprint provides a high‑density assembly option for space‑constrained PCBs while supporting surface‑mount processes.
• RoHS compliance: Supports lead‑free manufacturing requirements for regulated production environments.

Why Choose EP3SL200F1152I3N?

The EP3SL200F1152I3N combines substantial logic resources, significant embedded memory, and a high I/O count in a compact 1152‑BBGA surface‑mount package. Its industrial temperature rating and RoHS compliance make it a practical choice for engineers building robust, high‑density systems that require on‑device memory and extensive external interfacing.

This device is well suited for teams and products that need scalable logic capacity and integration to reduce component count and simplify board design while maintaining operational reliability across a broad temperature range.

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