EP3SL200F1152I4

The EP3SL200F1152I4 is a Stratix® III L Field Programmable Gate Array (FPGA) IC offering a high-density programmable logic fabric with 200,000 logic elements and approximately 10.9 Mbits of embedded RAM. It is supplied in a 1152-BBGA FCBGA package (supplier device package: 1152-FBGA, 35×35) and is designed for surface-mount assembly.

Targeted for industrial applications, this device combines large logic capacity, substantial on-chip memory, and a high I/O count to support complex control, interface, and processing functions within an industrial temperature range.

Key Features

• Core Capacity  200,000 logic elements provide extensive programmable resources for complex logic and custom processing implementations.
• Embedded Memory  Approximately 10.9 Mbits of on-chip RAM to support buffering, state storage, and local data processing without external memory.
• I/O Density  744 I/O pins to accommodate wide bus interfaces, multiple peripherals, and board-level system integration.
• Power / Voltage  Supports core voltage operation in the 860 mV to 1.15 V range for compatibility with low-voltage system domains.
• Package & Mounting  1152-BBGA (FCBGA) package with supplier device package specified as 1152-FBGA (35×35); surface-mount device suited for standard PCB assembly processes.
• Temperature Range  Industrial operating temperature from -40 °C to 100 °C for use in demanding environments.
• Grade  Industrial grade device suited to applications that require extended temperature performance.

Typical Applications

• Industrial Control  High logic capacity and I/O count enable implementation of motor control, PLC logic, and real-time control functions in industrial automation systems.
• High-density Interface Bridging  744 I/O and embedded RAM support wide parallel interfaces, protocol bridging, and custom packet handling between subsystems.
• Communications Equipment  On-chip memory and programmable logic resources permit implementation of custom framing, buffering, and hardware-accelerated data paths.
• Custom Embedded Processing  Large logic and memory resources allow integration of specialized datapaths, custom accelerators, and glue logic in compact designs.

Unique Advantages

• High logic density: 200,000 logic elements enable large-scale designs within a single FPGA, reducing the need for multiple devices and simplifying system architecture.
• Substantial on-chip RAM: Approximately 10.9 Mbits of embedded memory supports local buffering and state retention without immediate reliance on external memory.
• Extensive I/O capability: 744 I/O pins provide flexibility for wide buses, multiple interfaces, and complex board-level integration.
• Industrial temperature range: Rated from -40 °C to 100 °C for deployment in temperature-challenging environments typical of industrial applications.
• Low-voltage core operation: Core supply range from 860 mV to 1.15 V enables integration with modern low-voltage power architectures.
• Compact BGA packaging: 1152-BBGA / 1152-FBGA (35×35) package delivers high I/O and signal routing density in a surface-mount footprint.

Why Choose EP3SL200F1152I4?

The EP3SL200F1152I4 positions itself as a high-capacity, industrial-grade FPGA option that combines 200,000 logic elements, approximately 10.9 Mbits of embedded RAM, and 744 I/O pins in a compact 1152-BBGA package. Its operating temperature range of -40 °C to 100 °C and low-voltage core support make it suitable for demanding industrial designs that require both density and robustness.

This device is well suited to engineers and system designers building complex control, interface, and custom processing solutions who need a single FPGA with substantial logic, memory, and I/O resources to minimize board-level complexity and consolidate functionality.

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