EP3SL150F780C3G

The EP3SL150F780C3G is a Stratix III family Field Programmable Gate Array (FPGA) from Intel. It delivers a high-density, programmable logic platform with 142,500 logic elements and approximately 6.54 Mbits of embedded memory, suitable for high-performance logic, DSP, and embedded applications.

Designed for surface-mount implementation in a 780‑FBGA (29×29) package, this commercial‑grade device supports a core supply range of 0.86 V to 1.15 V and an operating temperature of 0 °C to 85 °C, making it appropriate for mainstream communication, compute, and interface-intensive designs.

Key Features

• Logic Capacity  142,500 logic elements provide substantial programmable fabric for complex control, state machines, and datapath implementations.
• Embedded Memory  Approximately 6.54 Mbits of on-chip RAM enable local buffering, FIFOs, and tight coupling with user logic without immediate external memory dependency.
• I/O Density  488 user I/Os in a modular bank structure support a wide variety of interfaces and signal standards for system integration.
• Core Voltage Range  Selectable core supply from 0.86 V to 1.15 V allows designers to balance performance and power within the device’s supported range.
• Package & Mounting  780-FBGA (29×29) package (780‑BBGA / FCBGA case) for high ball-count, surface-mount applications where I/O density and routing density matter.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for standard commercial deployments.
• Security & Reliability (Family Features)  Stratix III family devices offer optional 256‑bit AES configuration encryption and built-in configuration CRC and ECC protection for on-chip memories, enhancing design security and reliability.
• Family-Level Capabilities  As a Stratix III device, the architecture includes features such as selectable core voltage and programmable power technology to help manage power and performance trade-offs.
• Regulatory Compliance  RoHS‑compliant construction supports environmental and manufacturing requirements.

Typical Applications

• High‑Performance Signal Processing  Deploy DSP pipelines, custom filters, and datapath accelerators using the device’s large logic and memory resources for real‑time processing tasks.
• Networking & Communications  Implement protocol engines, packet processing, and interface bridging where high I/O count and programmable logic enable flexible protocol support.
• Memory Interface & Controller  Use the embedded RAM and programmable fabric to build memory controllers, buffering, and timing-critical interface logic.
• Embedded System & Prototyping  Develop complex embedded designs and system prototypes that require a balance of logic capacity, on-chip memory, and dense I/O in a compact BGA package.

Unique Advantages

• High Logic Density:  142,500 logic elements let you implement large combinational and sequential designs without immediate external logic expansion.
• Substantial On‑Chip RAM:  Approximately 6.54 Mbits of embedded memory reduces external memory dependence and lowers system BOM for many buffering and FIFO needs.
• Flexible I/O Count:  488 user I/Os give designers the freedom to connect multiple peripherals, memory buses, and high pin‑count interfaces.
• Configurable Power/Performance:  Supported core voltage range enables trade-offs between performance and power consumption to suit application needs.
• Security & Data Integrity:  Family-level support for AES configuration encryption, CRC, and ECC safeguards configuration and on-chip memory contents where enabled.
• Compact High‑Density Package:  780‑FBGA (29×29) packaging provides a high I/O ball count in a compact footprint for space-constrained boards.

Why Choose EP3SL150F780C3G?

The EP3SL150F780C3G combines significant programmable logic capacity, multi‑Mbit embedded memory, and nearly 500 I/Os in a high‑density BGA package, making it well suited for designers who need a flexible, integrated FPGA platform for compute‑intensive, interface‑rich applications. Its commercial temperature rating and RoHS compliance support standard production deployments.

As a member of the Stratix III device family, this device benefits from documented architecture features such as selectable core voltage and family-level security and reliability mechanisms, and it integrates with available development resources for system integration and megafunction support.

Request a quote or submit an inquiry for EP3SL150F780C3G to obtain pricing, availability, and additional technical information tailored to your design requirements.