EP3SL150F780C2N
| Part Description |
Stratix® III L Field Programmable Gate Array (FPGA) IC 488 6543360 142500 780-BBGA, FCBGA |
|---|---|
| Quantity | 667 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 488 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 5700 | Number of Logic Elements/Cells | 142500 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6543360 |
Overview of EP3SL150F780C2N – Stratix® III L Field Programmable Gate Array (FPGA), 780‑FBGA (29×29)
The EP3SL150F780C2N is a Stratix® III L Field Programmable Gate Array (FPGA) supplied in a 780‑ball FCBGA package (29×29). It delivers a large logic resource set, significant on‑chip RAM and a high I/O count in a surface‑mount package for commercial‑grade applications.
Engineered for designs that require substantial logic capacity, embedded memory and dense I/O, this device supports configurable system functions while operating within a commercial temperature range and industry‑standard low‑voltage supplies.
Key Features
- Core Logic 142,500 logic elements provide a large programmable fabric for implementing complex logic and control functions.
- Embedded Memory Approximately 6.54 Mbits of on‑chip RAM to support frame buffers, FIFOs and other memory‑intensive logic structures.
- I/O Density 488 user I/O pins enable high signal connectivity for external interfaces and peripheral integration.
- Package & Mounting 780‑BBGA FCBGA package (supplier package: 780‑FBGA, 29×29) in a surface‑mount form factor for board‑level assembly.
- Power Supply Operates from a core supply range of 860 mV to 1.15 V, enabling designs that target low‑voltage core domains.
- Operating Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Family Architecture Highlights Stratix III family features referenced in the device handbook include TriMatrix embedded memory blocks, DSP blocks, multi‑track interconnect, clock networks with PLLs, and support for high‑speed differential I/O interfaces with DPA.
- Configuration & Test The Stratix III handbook references configuration options, IEEE 1149.1 (JTAG) boundary‑scan testing and remote system upgrade capability for field updates and testability.
- Standards & Compliance RoHS‑compliant component meeting environmental requirements for lead‑free assembly.
Typical Applications
- High‑density logic designs — Implement complex custom logic, protocol handling or control functions that require large logic element counts.
- Memory‑intensive functions — Use on‑chip RAM for buffering, packet queues or temporary data storage where embedded memory reduces external memory dependency.
- High‑I/O interfacing — Integrate many parallel and serial interfaces using the device’s 488 I/O pins for board‑level system interconnects.
- Configurable system controllers — Leverage the Stratix III family’s configuration and JTAG support to enable field updates and in‑system testing.
Unique Advantages
- Large programmable fabric: 142,500 logic elements enable implementation of substantial logic and control functions on a single device, reducing the need for multiple FPGAs.
- Significant embedded memory: Approximately 6.54 Mbits of on‑chip RAM supports high‑throughput buffering and storage tasks without immediate reliance on external memory.
- High I/O count: 488 I/Os allow dense board‑level connectivity and flexible interfacing to peripherals and external components.
- Compact surface‑mount package: 780‑ball FCBGA (29×29) delivers high integration density suitable for compact, assembled PCBs.
- Low‑voltage core operation: Core supply range of 860 mV to 1.15 V supports designs targeting low‑voltage power domains and efficient power distribution.
- Commercial temperature rating: Rated 0 °C to 85 °C for mainstream electronic products and systems.
Why Choose EP3SL150F780C2N?
The EP3SL150F780C2N provides a combination of large logic capacity, substantial embedded RAM and high I/O density in a single Stratix III L FPGA device. Its package and electrical specifications make it suitable for commercial applications that need consolidated programmable logic and memory resources while maintaining compact board footprint and surface‑mount assembly.
This device is well suited for engineering teams and procurement focused on scalable, FPGA‑based implementations where on‑chip resources and configurability reduce external component count and simplify system architecture. The Stratix III family handbook references additional architectural elements—such as DSP blocks, TriMatrix memory blocks, PLLs and configuration/test features—that support a wide range of programmable system functions.
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