EP3SL110F780I3N

The EP3SL110F780I3N is a Stratix® III L Field Programmable Gate Array from Intel, delivered in a 780-ball FCBGA package. It combines a high logic capacity with significant embedded RAM and broad I/O count to address demanding system integration needs.

Designed for industrial-grade applications, this device offers a wide operating temperature range and flexible supply voltage margin, enabling deployment in robust embedded and industrial systems that require programmable digital logic, on-chip memory, and high channel connectivity.

Key Features

• Logic Capacity 107,500 logic elements providing substantial programmable logic resources for complex designs.
• Logic Blocks 4,300 logic blocks (LABs) to organize and optimize logic placement and routing.
• Embedded Memory Approximately 4.99 Mbits of embedded memory for data buffering, state storage, and local algorithm implementation.
• I/O Density 488 general-purpose I/O pins to support wide peripheral and bus interfacing requirements.
• Package & Mounting 780-BBGA (FCBGA) package with a 29 × 29 supplier device footprint, designed for surface-mount assembly.
• Power Core supply range from 0.86 V to 1.15 V to match system power-rail choices and support performance/power tradeoffs.
• Temperature Range Industrial operating range from −40 °C to 100 °C for reliable operation in demanding environments.
• Compliance RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• Industrial Automation Implement machine control logic, sensor interfacing, and custom I/O aggregation using the device’s high logic count and 488 I/Os.
• Communications Infrastructure Use embedded memory and large I/O capacity for protocol processing, framing, and custom packet handling.
• Signal Processing Deploy on-chip RAM and abundant logic elements for real-time data path processing, filtering, and algorithm acceleration.
• Test & Measurement Create configurable data acquisition and timing-control subsystems that leverage the device’s I/O density and logic resources.

Unique Advantages

• High programmable density: 107,500 logic elements enable integration of complex functions that reduce external components and simplify system architecture.
• Substantial embedded memory: Approximately 4.99 Mbits of on-chip RAM minimizes reliance on external memory for buffering and state machines, lowering BOM and latency.
• Extensive I/O count: 488 I/Os provide flexibility for interfacing numerous peripherals, buses, and sensors without additional bridge components.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in harsh or tightly controlled environments.
• Compact FCBGA package: 780-ball FCBGA (29 × 29) offers a high-density footprint for space-constrained boards while supporting surface-mount manufacturing.
• RoHS compliant: Meets common environmental compliance needs to streamline product certification and manufacturing processes.

Why Choose EP3SL110F780I3N?

The EP3SL110F780I3N positions itself as a high-capacity, industrial-grade FPGA option for designers who need significant programmable logic, embedded memory, and extensive I/O in a single device. Its combination of 107,500 logic elements, approximately 4.99 Mbits of embedded RAM, and 488 I/Os makes it suitable for complex embedded systems where integration and reliability matter.

This device is well-suited to engineering teams building industrial automation, communications, signal processing, or test equipment who require scalable logic resources, a robust operating temperature range, and a compact FCBGA package for dense board designs.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the EP3SL110F780I3N. Our team will respond with detailed commercial terms and support for your procurement needs.