EP3SL110F780I3G

The EP3SL110F780I3G is a Stratix III family FPGA in a 780-ball FCBGA package, designed for high-performance programmable logic, DSP and embedded system applications. It integrates 107,500 logic elements, approximately 4.99 Mbits of on-chip embedded memory, and 488 user I/O pins to support complex, I/O‑rich designs in industrial environments.

Built on a 1.1 V, 65‑nm process with selectable core voltage and programmable power technology, this device targets applications that require a balance of performance, power management and system integration within a surface-mount 780‑FBGA (29×29) package and an operating range of −40 °C to 100 °C.

Key Features

• Core and Architecture Stratix III family architecture on a 1.1‑V, 65‑nm all‑layer copper SRAM process with selectable core voltage and Programmable Power Technology to tune performance versus power.
• Logic Capacity 107,500 logic elements to implement large, high‑density logic designs.
• Embedded Memory Approximately 4.99 Mbits of on‑chip RAM for buffering, FIFOs and on‑chip data storage.
• DSP and Multiplier Resources Family-level support for high‑speed DSP blocks and dedicated multipliers (9×9, 12×12, 18×18, 36×36) providing hardware multiplication and MAC capabilities for signal processing workloads.
• I/O and High‑Speed Interfaces 488 user I/O pins and modular I/O bank architecture with Dynamic On‑Chip Termination (OCT) and support for high‑speed differential I/O, SERDES and dynamic phase alignment enabling 1.6 Gbps signaling.
• Clocking and PLLs Multi‑level clocking resources including up to 16 global clocks and up to 12 phase‑locked loops (PLLs) for flexible clock management and synthesis.
• Security and Reliability Optional 256‑bit AES encryption for configuration bitstream protection, integrated CRC for configuration memory error detection, and ECC for TriMatrix memory blocks to support high availability applications.
• Power and Packaging Core supply range from 860 mV to 1.15 V with surface‑mount 780‑FBGA (29×29) packaging; industrial grade operation from −40 °C to 100 °C.

Typical Applications

• High‑Performance Signal Processing — Implement FIR filters, FFTs and other DSP algorithms using dedicated multiplier and DSP block resources for communications and instrumentation systems.
• Networking and Communications — Support high‑speed serial links, SERDES interfaces and modular I/O bank configurations for switch, router and telecom interface designs.
• Memory Interface Controllers — Implement controllers for DDR/DDR2/DDR3 and other external memories using the device’s memory interface support and dedicated DQS logic.
• Embedded Systems and Prototyping — Integrate custom processors, peripherals and IP; supports Nios II embedded processor and Altera/Intel Megafunction IP for rapid system integration.

Unique Advantages

• High integration density: 107,500 logic elements and ~4.99 Mbits of embedded memory reduce the need for external logic and memory, simplifying board design.
• Flexible power/performance tradeoffs: Selectable core voltage and Programmable Power Technology let designers tune the device for higher performance or lower power consumption.
• Robust I/O capability: 488 user I/O with modular banks, dynamic OCT and SERDES support enable diverse interface options and signal‑integrity controls.
• Built‑in reliability features: AES configuration security, CRC for configuration memory and ECC for embedded RAM help protect designs and improve system availability.
• Clocking and timing flexibility: Multiple global/regional clocks and up to 12 PLLs allow complex clocking schemes and dynamic clock management.
• Industrial temperature rating: Tested for operation from −40 °C to 100 °C to meet demanding environmental requirements.

Why Choose EP3SL110F780I3G?

The EP3SL110F780I3G delivers a balanced combination of large logic capacity, substantial on‑chip memory and extensive I/O resources in a single 780‑FBGA package. Its Stratix III architecture, selectable core voltage and programmable power features provide designers with the flexibility to optimize systems for performance or efficiency while maintaining robust security and reliability features for production deployments.

This device is well suited to engineers building high‑performance DSP, networking, memory‑interface or embedded systems that require scalable logic density, flexible clocking and industrial‑grade temperature operation. The on‑chip resources and family-level support for processor IP and megafunctions enable faster system integration and reduced BOM complexity.

Request a quote or submit a product inquiry to evaluate EP3SL110F780I3G for your next design.